The invention relates to a temperature switch comprising a housing (2), a switching system (3) consisting of a first support (3.1) with a fixed contact (3.2) and a second support (3.3), on which a switch spring (3.4) with a switch contact (3.5) is arranged and a switching arrangement (4), which effects a positional change of the switch contact (3.5) as a function of the temperature.

An electromechanical switching device includes a first electrode, comprising layers of a first 2D layered material, which layers exhibit a first surface; a second electrode, comprising layers of a second 2D layered material, which layers exhibit a second surface opposite the first surface; and an actuation mechanism; wherein each of the first and second 2D layered materials has an anisotropic electrical conductivity, which is lower transversely to its layers than in-plane with the layers; the first electrode includes two distinct areas alongside the first surface, which areas differ in at least one structural, electrical and/or magnetic property; and at least one of the first and second electrodes is actuatable by the actuation mechanism, such that actuation thereof for modification of an electrical conductance transverse to each of the first surface and the second surface to enable current modulation between the first electrode and the second electrode.

The circuit breaking system contains a power circuit whose voltage is greater than 600 volts, at least a circuit breaking device, at least a current detection device, a current reduction unit, at least an actuation device, and a linking device. The circuit breaking system is applicable to a high or ultra-high voltage power circuit, and the power circuit is interrupted through purely mechanical means without additional electricity provision. Even when there are major disasters that existing protection means fails, the present invention can still function and provides a trip free, ultimate self-protection mechanism so that a power system can be readily reset.

An actuator device which includes a fixed support structure, an actuation member movable, a biasing member tending to maintain the actuation member in a rest position, a shape-memory wire connected to the structure and to the actuation member, and an electric circuit for supplying an electric current to the shape-memory wire. The circuit includes a pair of terminals. One end of the shape-memory wire is connected to a first terminal. The circuit includes further an electric switch, including a first conducting member electrically connected with the second terminal, and a second conducting member carried by the actuation member and electrically connected with the other end of the shape-memory wire. The switch is closed when the actuation member is in the rest position, and remains closed until when the actuation member reaches a working position, and opens when the actuation member passes beyond the working position.

A base member includes a terminal fixing part for blocking an entire surface of an opening part of a housing at a position further inner than an opening end part of the housing when the base member is inserted in the housing. A first electrode part formed by a tip part of two bent stages that are composed of a horizontal part, a vertical part, and a horizontal part and configured by bending a portion of a part of the fixed side fixed a conductive member, which is continuous with a first external connection terminal, in a direction perpendicular to a continuous direction.

A base member includes a terminal fixing part for blocking an entire surface of an opening part of a housing at a position further inner than an opening end part of the housing when the base member is inserted in the housing. A first electrode part formed by a tip part of two bent stages that are composed of a horizontal part, a vertical part, and a horizontal part and configured by bending a portion of a part of the fixed side fixed a conductive member, which is continuous with a first external connection terminal, in a direction perpendicular to a continuous direction.

A system includes a first electrically conductive electrode and a second electrically conductive electrode. The system further includes a magnetic field source. The system also includes a magnetic shape memory (MSM) alloy positioned within a magnetic field of the magnetic field source with a portion of the MSM alloy being coupled with the first electrically conductive electrode. The magnetic field causes the MSM alloy to bend to contact the second electrically conductive electrode when the MSM alloy is in a first state. The magnetic field has no or negligible effect on the MSM alloy when the MSM alloy is in a second state.

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependence on the control voltage.