Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

An electron emission apparatus, an electron gun, and a method of fabrication of the electron gun are provided. The electron gun includes a cathode, a Wehnelt, and an anode. The cathode is configured to provide an electron beam. The Wehnelt has a bore. The bore is configured to pass the electron beam. The anode is disposed proximate to the cathode. The diameter of the bore of the Wehnelt and the offset between the Wehnelt and the cathode satisfy a predetermined dimensional relationship. The predetermined dimensional relationship is at least a function of a diameter of the bore of the anode and a distance between the Wehnelt and the anode.

An electron emission apparatus, an electron gun, and a method of fabrication of the electron gun are provided. The electron gun includes a cathode, a Wehnelt, and an anode. The cathode is configured to provide an electron beam. The Wehnelt has a bore. The bore is configured to pass the electron beam. The anode is disposed proximate to the cathode. The diameter of the bore of the Wehnelt and the offset between the Wehnelt and the cathode satisfy a predetermined dimensional relationship. The predetermined dimensional relationship is at least a function of a diameter of the bore of the anode and a distance between the Wehnelt and the anode.

The present invention is directed to an electrode component with at least two electrodes or a multipole component as generally known in the art. Each of the electrodes can be provided with a beam neighboring section or end section forming the free electrodes. This section is the section exposed to high voltages, i.e. more than 10 KV, and is intended to nevertheless work very reliable and precise with respect to the guidance and/or controlling of a beam of a charged particle beam in a microscope or lithographic apparatus. This neighboring section are positioned in the vicinity or close to a charged particle beam or even facing it. This bears the preferred advantage that high voltages can be generated by the electrodes or to the electrode component and they can withstand those high voltages. This assists in a better guidance and/or controlling of the charged beam, such as for compensating aberration etc. The beam neighboring section can have a surface configured to face the beam. This neighboring section or surface are fabricated with absolute dimensional tolerances less than a desired maximum absolute dimensional tolerance wherein the desired maximum absolute dimensional tolerance is based at least on a maximum voltage to be applied to the electrode. With such a precisely fabricated surface, a more precise and/or efficient field can be generated being able to control the charged particle beam more precisely and efficiently.

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a first film layer disposed on the electrode about a periphery of the electrode; and a second film layer disposed on the first film layer, the second film layer including a plurality of electrically conductive grid lines patterned therein that are supported only at the periphery of the electrode by the first film layer.

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a first film layer disposed on the electrode about a periphery of the electrode; and a second film layer disposed on the first film layer, the second film layer including a plurality of electrically conductive grid lines patterned therein that are supported only at the periphery of the electrode by the first film layer.

A field emission cathode device and method for forming a field emission cathode device involve a cathode element having a field emission surface disposed in spaced-apart relation to a gate electrode element so as to define a gap between the field emission surface and the gate electrode element. The gate electrode element extends laterally between opposing anchored ends. The gate electrode element is arranged to deform away from the field emission surface in response to heat, so as to increase the gap between the field emission surface and the gate electrode element.

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a first film layer disposed on the electrode about a periphery of the electrode; and a second film layer disposed on the first film layer, the second film layer including a plurality of electrically conductive grid lines patterned therein that are supported only at the periphery of the electrode by the first film layer.