An infrared light radiation device includes a radiation unit and a condenser. The radiation unit includes a heater and a metamaterial structure. The metamaterial structure is able to radiate, when heat energy is input from the heater, infrared light having a peak wavelength of a non-Planck distribution. The condenser includes at least one condensing lens that concentrates and transmits toward outside the infrared light radiated from the radiation unit.

A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

A light-emitting device includes: a substrate having a groove extending in a first direction and a first surface and a second surface respectively arranged to sandwich the groove in a second direction; a first electrode provided on the first surface; a second electrode provided on the second surface; a graphite thin film provided on the first electrode and the second electrode and extending from the first electrode to the second electrode along the second direction in such a way as to be astride the groove; a third electrode provided on the graphite thin film in such a way as to be opposite the first electrode via the graphite thin film; and a fourth electrode provided on the graphite thin film in such a way as to be opposite the second electrode via the graphite thin film.

To aim at a prevention of an occurrence of failure in and an extension of the life span of an incandescent light bulb by reducing the impact of an external force, which is applied to an outer lead wire positioned outside a bulb, on the connections between the lead wire and another element when manufacturing the incandescent light bulb, especially in a socket mounting process. In an incandescent light bulb wherein a filament assembly having filaments and lead wires which support the filaments is sealed in a bulb, a shape which, being easy to bend, enables a reduction in the impact of an applied external force on another element is imparted to a region of a predetermined length which includes the boundary of the lead wires between inside and outside the bulb. For example, a region in which the cross-sectional shape of the lead wires is changed by crushing is provided.

To provide a socket for a halogen lamp, which allows easy attachment and removal operations, as well as enables stable contact between a lamp terminal and an external electrode terminal when the lamp is attached. The socket includes a first holder part having a first hole, a second holder part having a second hole, and a spring member accommodated at a position between the first hole and the second hole and having a third hole. The first hole, second hole, and third hole have a shape extending in a direction that is different from a direction in which the terminal is passed through. The terminal is turned after being passed through the holes, whereby the terminal moves inside the first hole, second hole, and third hole, and is fixed when the terminal reaches an outer edge portion of the third hole of the spring member.

To provide a socket for a halogen lamp, which allows easy attachment and removal operations, as well as enables stable contact between a lamp terminal and an external electrode terminal when the lamp is attached. The socket includes a first holder part having a first hole, a second holder part having a second hole, and a spring member accommodated at a position between the first hole and the second hole and having a third hole. The first hole, second hole, and third hole have a shape extending in a direction that is different from a direction in which the terminal is passed through. The terminal is turned after being passed through the holes, whereby the terminal moves inside the first hole, second hole, and third hole, and is fixed when the terminal reaches an outer edge portion of the third hole of the spring member.

A emitter is formed of a thin-film membrane disposed within a cavity so as to provide a output beam. The emitter may be configured to obtain broadband light. The emitter may enhance the emissivity of light over a broad spectral band.

An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 m or less thickness.

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.