A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

To provide a socket for a halogen lamp, which allows easy attachment and removal operations, as well as enables stable contact between a lamp terminal and an external electrode terminal when the lamp is attached. The socket includes a first holder part having a first hole, a second holder part having a second hole, and a spring member accommodated at a position between the first hole and the second hole and having a third hole. The first hole, second hole, and third hole have a shape extending in a direction that is different from a direction in which the terminal is passed through. The terminal is turned after being passed through the holes, whereby the terminal moves inside the first hole, second hole, and third hole, and is fixed when the terminal reaches an outer edge portion of the third hole of the spring member.

To provide a socket for a halogen lamp, which allows easy attachment and removal operations, as well as enables stable contact between a lamp terminal and an external electrode terminal when the lamp is attached. The socket includes a first holder part having a first hole, a second holder part having a second hole, and a spring member accommodated at a position between the first hole and the second hole and having a third hole. The first hole, second hole, and third hole have a shape extending in a direction that is different from a direction in which the terminal is passed through. The terminal is turned after being passed through the holes, whereby the terminal moves inside the first hole, second hole, and third hole, and is fixed when the terminal reaches an outer edge portion of the third hole of the spring member.

An infrared emitter that comprises a cladding tube made of quartz glass that surrounds a heating filament as an infrared radiation-emitting element that is connected via current feedthroughs to an electrical connector outside the cladding tube. To improve the service life and power density, the heating filament comprises a carrier plate with a surface made of an electrically insulating material, whereby the surface is covered by a printed conductor made of a material that generates heat when current flows through it.

A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode penetrates through the plurality of second internal electrodes, is exposed at the first surface of the capacitor body, and is spaced apart from the first via electrode. First and second external electrodes are on a first surface of the capacitor body, spaced apart from each other, and respectively connected to end portions of the first and second via electrodes. The first and second external electrodes each include a nickel (Ni) layer on the first surface of the capacitor body and a gold (Au) plating layer on the nickel layer.

Methods and apparatus disclosed herein generally relate to lamp heating of process chambers used to process semiconductor substrates. More specifically, implementations disclosed herein relate to arrangement and control of lamps for heating of semiconductor substrates. In some implementations of the present disclosure, fine-tuning of temperature control is achieved by dividing different lamps within an array of lamps into various subgroups or lamp assemblies defined by a specific characteristic. These various subgroups may be based on characteristics such as lamp design and/or lamp positioning within the processing chamber.

A emitter is formed of a thin-film membrane disposed within a cavity so as to provide a output beam. The emitter may be configured to obtain broadband light. The emitter may enhance the emissivity of light over a broad spectral band.

A vapor deposition source that includes a substantially vertical plate to which first and second filament posts are coupled. The vapor deposition source also includes a filament having a first end and a second end. The filament provides a substantially concentric source of electrons. The first end of the filament is connected to the first filament post and the second end of the filament is connected to the second filament post. The first end of the filament is substantially vertically aligned with the second end of the filament when the filament is connected to the first and second posts.

A vapor deposition source that includes a substantially vertical plate to which first and second filament posts are coupled. The vapor deposition source also includes a filament having a first end and a second end. The filament provides a substantially concentric source of electrons. The first end of the filament is connected to the first filament post and the second end of the filament is connected to the second filament post. The first end of the filament is substantially vertically aligned with the second end of the filament when the filament is connected to the first and second posts.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.