A semiconductor device includes a substrate including a first active region, a second active region and a field region between the first and second active regions, and a gate structure formed on the substrate to cross the first active region, the second active region and the field region. The gate structure includes a p type metal gate electrode and an n-type metal gate electrode directly contacting each other, the p-type metal gate electrode extends from the first active region less than half way toward the second active region.

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.

An ESD protection diode in a semiconductor device includes: a semiconductor substrate; a diode group that has a plurality of grouped VNW diodes, each of the VNW diodes having a VNW having a lower end and an upper end, that are formed on the semiconductor substrate and have a semiconductor material; and a top plate that is formed above the diode group and is a conductive layer electrically connected to the upper ends of the VNWs of the respective VNW diodes, and there is fabricated the semiconductor device that is capable of, even when large current flows through the VNW diode, suppressing current concentration and preventing damage of the VNW diode.

An electronic circuit includes a first electronic component formed above a buried insulating layer of a substrate and a second electronic component formed under the buried insulating layer. The insulating layer is thoroughly crossed by a semiconductor well. The semiconductor well electrically couples a terminal of the first electronic component to a terminal of the second electronic component.

An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.

A semiconductor device includes a fin-type pattern extending in a first direction, a device isolation film surrounding the fin-type pattern, while exposing an upper portion of the fin-type pattern, a gate electrode extending on the device isolation film and the fin-type pattern in a second direction intersecting the first direction, a gate isolation film isolating the gate electrode in the second direction, and including a first material and on the device isolation film, an interlayer insulating film filling a side surface of the fin-type pattern and including a second material different from the first material.

The present disclosure provides an electronic device that includes a substrate. The substrate includes a well and a peripheral insulating wall laterally surrounding the well. At least one lateral bipolar transistor is formed in the well, and the at least one transistor has a base region extending under parallel collector and emitter regions. The peripheral insulating wall is widened in a first direction, parallel to the collector and emitter regions, so that the base region penetrates into the peripheral insulating wall.

A system and method for combining positive and negative voltage electrostatic discharge (ESD) protection into a clamp that uses cascoded circuitry, including detecting, by an electrostatic discharge protection system, a voltage pulse on an input pin of an integrated circuit (IC) controller, the IC controller coupled between a power supply node and a ground supply node; determining, by the ESD protection circuit, an ESD event on the input pin based on the voltage detected on the input pin; and/or controlling, by the ESD protection circuit during the ESD event, one or more clamps to transport the voltage pulse from the input pin of the IC controller to the power supply node.

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes first and second gate dielectric layers over a fin. First and second gate electrodes are over the first and second gate dielectric layers, respectively, the first and second gate electrodes both having an insulating cap having a top surface. First dielectric spacer are adjacent the first side of the first gate electrode. A trench contact structure is over a semiconductor source or drain region adjacent first and second dielectric spacers, the trench contact structure comprising an insulating cap on a conductive structure, the insulating cap of the trench contact structure having a top surface substantially co-planar with the insulating caps of the first and second gate electrodes.

Various apparatuses, systems, methods, and media are disclosed to provide over-voltage protection to a data interface of a multi-protocol memory card that includes a first communication interface and a second communication interface that enable communication using different protocols. An interface voltage protection circuit includes a control circuit configured to receive a first supply voltage for operating the first communication interface. The interface voltage protection circuit further includes a pull-down circuit operatively connected with the control circuit, configured to pull down a voltage at a supply voltage rail of the second communication interface such that a voltage at a plurality of connector terminals of the second communication interface is lower than the first supply voltage.