An embodiment of the present invention provides an element transferring method that may increase a yield of transferring an element, and an electronic panel manufacturing method using the same. The element transferring method includes: preparing a carrier film in which a first surface of an element on which a terminal is formed is adhered to an adhesive surface; providing a cover adhesive layer on the adhesive surface so that the second surface of the element that is opposite to the first surface and where the terminal is not formed is covered; transferring the element to the target substrate by adhering the cover adhesive layer to the target substrate while the second surface is facing the target substrate; and separating the carrier film from the element, wherein in transferring the element, the carrier film is pressed so that the surface of the cover adhesive layer is flat at the same height as the terminal.

A first pixel configured to emit light of a first color, a second pixel configured to emit light of a second color; and a third pixel configured to emit light of a third color are provided. The first pixel includes a first subpixel and a second subpixel each including a quantum dot light-emitting layer. A light-emission peak wavelength of the second subpixel is longer than a light-emission peak wavelength of the first subpixel.

A display device includes a first electrode, a second electrode disposed spaced apart from the first electrode in a first direction, and an element part disposed between the first electrode and the second electrode. The element part includes light-emitting elements that have a shape extending in one direction and are arranged spaced apart from each other in a second direction perpendicular to the first direction; and a binder surrounding each of the light-emitting elements and fixing the light-emitting elements. The one direction in which the light-emitting elements extend is parallel to the first direction.

A unit pixel of a microdisplay is disclosed. In the unit pixel, sub-pixels that form blue light, green light, and red light are vertically stacked on a growth substrate. Accordingly, the unit pixel area may be reduced, and pixel transfer processing is facilitated.

A display device comprises a signal line on a first surface of a substrate, a lightemitting element on the signal line and comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, a connection line on a second surface of the substrate and electrically connected to the signal line, and conductive lines on the second surface of the substrate and separated from the connection line. The conductive lines comprise a first conductive layer and a second conductive layer covering the first conductive layer.

A display device includes a substrate including a display area including pixels, a pad area comprising pads and located adjacent to the display area and a side wiring area located adjacent to the pad area; and a printed circuit film attached to the pad area located on a back surface of the first substrate. The plurality of pads include first pads that electrically connect the printed circuit film to the pixels and at least one second pad disposed between adjacent ones of the first pads. The display device further includes at least one connection portion that electrically connects a first pad of the first pads and the at least one second pad to each other. Each of the first pads includes a first-first pad located on a front surface of the first substrate and a first-second pad located on the back surface of the first substrate.

In an LED display device according to an embodiment of the present disclosure, the LED display device comprises a second pixel driving circuit on a substrate, an LED element attached to a region not overlapping the second pixel driving circuit, including a first LED element, a second LED element and a growth substrate, and providing a double light-emitting spectrum, an element fixing layer surrounding the LED element, a first pixel driving circuit on the element fixing layer, and an element protecting layer on the first pixel driving circuit. In addition, the first LED element is controlled by the first pixel driving circuit, and the second LED element is controlled by the second pixel driving circuit. Therefore, the LED display device provides a dual emission spectrum, can realized high luminance and high definition, and can prevent a pixel defect.

A display panel and a display device are described. The display panel includes a first display area, the first display area includes a first external area and a first compression area, and the first compression area is located at a side in a first direction of the first external area, wherein the first direction is parallel to the data line. The display panel further includes a plurality of first light-emitting units and a plurality of first pixel driving circuits.

A display device includes a lower metal layer disposed on a surface of a substrate and including a first opening overlapping a rear emission pixel in a plan view; a first electrode and a second electrode disposed in each of the rear emission pixel and a front emission pixel, the first electrode and the second electrode being spaced apart from each other on the lower metal layer; first light emitting elements disposed between the first electrode and the second electrode disposed in the rear emission pixel; second light emitting elements disposed between the first electrode and the second electrode disposed in the front emission pixel; and a reflective layer disposed on the first light emitting elements and overlapping the rear emission pixel in a plan view, the reflective layer overlaps at least one of the first light emitting elements in a plan view.

An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.