Structured photovoltaic assemblies and method of manufacture therefor. The assemblies can be assembled similar to flex circuits and have mechanical support structures disposed within the assembly. The supports can be sized and shaped to one or a group of solar cells in the assembly. The solar cells supported by a particular support may be interconnected with cells supported by a different support. The supports can be transparent. The connection of the interconnects to the solar cells can be enhanced by forming protrusions in vias through openings in the Insulating layer that are aligned with the solar cells. Alternatively, the openings can be filled with a conductive material in such forms as powder, ink, paste, or metal nanoparticles, and a laser can be used to melt and/or sinter the material to form the connection to the solar cell. These techniques can withstand large temperature swings over a large number of cycles, which occur in, for example, space applications.

A colored solar module is provided, in which at least one solar cell is embedded in an encapsulation layer, and a transparent plate is disposed on the encapsulation layer. The transparent plate has a single coating layer containing quartz for attaching onto the encapsulation layer so as to reflect the desired color light.

A colored solar module is provided, in which at least one solar cell is embedded in an encapsulation layer, and a transparent plate is disposed on the encapsulation layer. The transparent plate has a single coating layer containing quartz for attaching onto the encapsulation layer so as to reflect the desired color light.

A production method is provided in which submicronic particles containing silicon are incorporated into a matrix, wherein, during the incorporation of the particles, the particles are in a compacted state with a bulk density of more than 0.10 grams per cubic centimeter, and the compacted particles have a specific surface area at least 70% of that of the particles considered separately without contact between each other.

Semitransparent chalcogen solar cells and techniques for fabrication thereof are provided. In one aspect, a method of forming a solar cell includes: forming a first transparent contact on a substrate; depositing an n-type layer on the first transparent contact; depositing a p-type chalcogen absorber layer on the n-type layer, wherein a p-n junction is formed between the p-type chalcogen absorber layer and the n-type layer; depositing a protective interlayer onto the p-type chalcogen absorber layer, wherein the protective interlayer fully covers the p-type chalcogen absorber layer; and forming a second transparent contact on the interlayer, wherein the interlayer being disposed between the p-type chalcogen absorber layer and the second transparent contact serves to protect the p-n junction during the forming of the second transparent contact. Solar cells and other methods for formation thereof are also provided.

The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.

A method of repairing a solar cell bonded on a substrate, by bonding a replacement solar cell on top of an existing solar cell, without removing the existing solar cell. The substrate may comprise a flexible circuit, printed circuit board, flex blanket, or solar cell panel. The bonding of the replacement solar cell on top of the existing solar cell uses a controlled adhesive pattern. Electrical connections for the existing solar cell and the replacement solar cell are made using electrical conductors on, above or embedded within the substrate. The electrical connections may extend underneath the replacement solar cell. The method further comprises removing interconnects for the electrical connections for the existing solar cell, and then welding or soldering interconnects for the electrical connections for the replacement solar cell.

A method of fabricating a solar cell assembly comprising a plurality of solar cells mounted on a flexible support, the support comprising a conductive layer on the top surface thereof divided into two electrically isolated portions—a first conductive portion and a second conductive portion. Each solar cell comprises a front surface, a rear surface, and a first contact on the rear surface and a second contact on the front surface. Each one of the plurality of solar cells is placed on the first conductive portion with the first contact electrically connected to the first conductive portion so that the solar cells are connected through the first conductive portion. A second contact of each solar cell is then connected to the second conductive portion by an interconnect. The two conductive portions serve as bus bars representing contacts of two different polarities of the solar cell assembly.

Example embodiments relate to controlling detection time in photodetectors. An example embodiment includes a device. The device includes a substrate. The device also includes a photodetector coupled to the substrate. The photodetector is arranged to detect light emitted from a light source that irradiates a top surface of the device. A depth of the substrate is at most 100 times a diffusion length of a minority carrier within the substrate so as to mitigate dark current arising from minority carriers photoexcited in the substrate based on the light emitted from the light source.

A method of generating a germanium structure includes performing an epitaxial depositing process on an assembly of a silicon substrate and an oxide layer, wherein one or more trenches in the oxide layer expose surface portions of the silicon substrate. The epitaxial depositing process includes depositing germanium onto the assembly during a first phase, performing an etch process during a second phase following the first phase in order to remove germanium from the oxide layer, and repeating the first and second phases. A germanium crystal is grown in the trench or trenches. An optical device includes a light-incidence surface formed by a raw textured surface of a germanium structure obtained by an epitaxial depositing process without processing the surface of the germanium structure after the epitaxial process.