The present invention relates to a load arrangement for use in an electrical power arrangement and for arrangement at a first external electrically conductive element (5). The load arrangement comprises a load (2), a first electrode (3) electrically connected to the load (2), a dielectric layer (4) and a carrier carrying the load (2), the first electrode (3) and the dielectric layer (4). The load (2), the first electrode (3) and the dielectric layer (4) form a structure, which is configured for being arranged at the first external electrically conductive element (5). The first electrode (3) and the dielectric layer (4) are arranged to form, in combination with a first external electrically conductive element (5) representing an outer surface of a marine structure, a capacitor (6) for capacitive transmission of electrical power between the first electrode (3) and the first external element (5). The carrier is configured for being arranged at the first external electrically conductive element (5). The load (2) is connected to a second electrode (7) electrically insulated from the first electrode (3) or is arranged for being electrically connected to a second external electrically conductive element (10, 11) electrically insulated from the first electrode (3).

A UV LED package disclosed herein includes a submount, a UV LED chip adapted to emit UV light at 200 nm to 400 nm, and a package body mounted with the submount. The submount includes a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from each other by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film. The UV LED chip includes a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad. The UV LED chip is flip-chip bonded to the submount through a first bonding bump interposed between the first flip-chip bonding pad and the first conductive electrode pad and a second bonding bump interposed between the second flip-chip bonding pad and the second conductive electrode pad. The package body includes a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire.

A UV LED package disclosed herein includes a submount, a UV LED chip adapted to emit UV light at 200 nm to 400 nm, and a package body mounted with the submount. The submount includes a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from each other by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film. The UV LED chip includes a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad. The UV LED chip is flip-chip bonded to the submount through a first bonding bump interposed between the first flip-chip bonding pad and the first conductive electrode pad and a second bonding bump interposed between the second flip-chip bonding pad and the second conductive electrode pad. The package body includes a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire.

A light-emitting component includes an insulating substrate, plural light-emitting elements, and plural thyristors. The plural light-emitting elements are disposed on the substrate and constituted by a first stacked semiconductor layer, the first stacked semiconductor layer being obtained by stacking plural semiconductor layers. The plural thyristors are constituted by a second stacked semiconductor layer disposed on the substrate such that the light-emitting elements and the thyristors are arranged side by side, connected to the plural light-emitting elements, respectively, and turn on to drive the light-emitting elements to emit light or to increase an emitted light amount, the second stacked semiconductor layer being obtained by stacking plural semiconductor layers that are different from the semiconductor layers of the first stacked semiconductor layer.

A light-emitting component includes an insulating substrate, plural light-emitting elements, and plural thyristors. The plural light-emitting elements are disposed on the substrate and constituted by a first stacked semiconductor layer, the first stacked semiconductor layer being obtained by stacking plural semiconductor layers. The plural thyristors are constituted by a second stacked semiconductor layer disposed on the substrate such that the light-emitting elements and the thyristors are arranged side by side, connected to the plural light-emitting elements, respectively, and turn on to drive the light-emitting elements to emit light or to increase an emitted light amount, the second stacked semiconductor layer being obtained by stacking plural semiconductor layers that are different from the semiconductor layers of the first stacked semiconductor layer.

A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.

A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.

An optoelectronic device includes a substrate; a semiconductor stack, formed on the substrate; a current blocking region, including a first pad portion formed above the semiconductor stack and wherein the current blocking region includes transparent insulated material; a transparent conductive layer, formed on the current blocking region and/or a surface of the semiconductor stack; a first opening, formed in the first pad portion, wherein in a top view, the first opening includes elongated shape; and a first electrode, including a first pad electrode formed above the first pad portion of the current blocking region and electrically connecting to the semiconductor stack through the first opening.

An optoelectronic device includes a substrate; a semiconductor stack, formed on the substrate; a current blocking region, including a first pad portion formed above the semiconductor stack and wherein the current blocking region includes transparent insulated material; a transparent conductive layer, formed on the current blocking region and/or a surface of the semiconductor stack; a first opening, formed in the first pad portion, wherein in a top view, the first opening includes elongated shape; and a first electrode, including a first pad electrode formed above the first pad portion of the current blocking region and electrically connecting to the semiconductor stack through the first opening.

A substrate for light-emitting diode, a backlight module and a display device are disclosed. The substrate for light-emitting diode includes a plurality of light-emitting sub-regions, and each of the plurality of light-emitting sub-regions includes at least two anode electrode pads electrically connected through a first parallel-connection line, and at least two cathode electrode pads electrically connected through a second parallel-connection line. The at least two cathode electrode pads are disposed in one-to-one correspondence with the at least two anode electrode pads. At least one series-connection electrode pad group is further disposed between the anode electrode pad and the cathode electrode pad which are corresponding to each other; and each of the at least one series-connection electrode pad group includes two series electrode pads which are electrically connected through a series-connection line.