In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence with a bottom side, a bottom coating located on the bottom side and an electrode layer located on an underside of the bottom coating facing away from the semiconductor layer sequence, wherein the bottom coating has a thickness gradient and at least one ridge line at which the bottom coating is thickest, wherein the electrode layer extends over the at least one ridge line such that a contact side of the electrode layer facing away from the semiconductor layer sequence follows the bottom coating true to shape, and wherein an electrical and mechanical contact plane of the contact side parallel to the bottom side is defined by the at least one ridge line.

A light-emitting device comprises a first semiconductor layer and a semiconductor mesa formed on the first semiconductor layer, wherein the first semiconductor layer comprises a first sidewall and a first semiconductor layer first surface surrounding the semiconductor mesa, and the semiconductor mesa comprises a second sidewall; and a first reflective structure comprising a first reflective portion covering the first sidewall and a second reflective portion covering the second sidewall, wherein the first reflective portion and the second reflective portion are connected to form a first reflective structure outer opening to expose the first semiconductor layer first surface in a top view of the light-emitting device.

A light-emitting device comprises a first semiconductor layer and a semiconductor mesa formed on the first semiconductor layer, wherein the first semiconductor layer comprises a first sidewall and a first semiconductor layer first surface surrounding the semiconductor mesa, and the semiconductor mesa comprises a second sidewall; and a first reflective structure comprising a first reflective portion covering the first sidewall and a second reflective portion covering the second sidewall, wherein the first reflective portion and the second reflective portion are connected to form a first reflective structure outer opening to expose the first semiconductor layer first surface in a top view of the light-emitting device.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

A display including a base, a plurality of pixels disposed on the base, at least one of the pixels including a first interconnect and a plurality of second interconnects, and a plurality of mounting portions on which a plurality of sub-pixels is to be mounted, in which a first portion of at least one the plurality of mounting portions is electrically connected to the first interconnect, a second portion of at least one of the plurality of mounting portions is electrically connected to one of the second interconnects, and at least one of the plurality of sub-pixels mounted on the plurality of mounting portions is configured to emit light of different wavelength.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

A LED display device is provided in the present disclosure, including multiple pixel units arranged in array on the substrate. Each of the pixel units includes three LEDs with different emitting colors. In each row of the pixel units, a first electrode of each LED is connected directly with a lateral through line. In each column of the pixel units, a second electrode of a red LED is electrically connected with a first vertical through line via a first via hole, a second electrode of a green LED is electrically connected with a second vertical through line via a second via hole, and a second electrode of a blue LED is electrically connected with a second vertical through line via a third via hole.

A LED display device is provided in the present disclosure, including multiple pixel units arranged in array on the substrate. Each of the pixel units includes three LEDs with different emitting colors. In each row of the pixel units, a first electrode of each LED is connected directly with a lateral through line. In each column of the pixel units, a second electrode of a red LED is electrically connected with a first vertical through line via a first via hole, a second electrode of a green LED is electrically connected with a second vertical through line via a second via hole, and a second electrode of a blue LED is electrically connected with a second vertical through line via a third via hole.