According to one embodiment, a display device includes pixels each including transistors, pixel electrodes, a contact electrode, and light emitting elements, and an insulating basement, a first organic insulating layer, a second organic insulating layer, a resin layer, a common electrode, and first wiring lines. The common electrode is electrically connected to cathodes of the light emitting elements, and electrically connected to the contact electrodes of the pixels. The first wiring lines, each provided between the first organic insulating layer and the second organic insulating layer or between the second organic insulating layer and the resin layer, are electrically connected to the contact electrodes of the pixels, and are formed of a metal.

According to one embodiment, a display device includes pixels each including transistors, pixel electrodes, a contact electrode, and light emitting elements, and an insulating basement, a first organic insulating layer, a second organic insulating layer, a resin layer, a common electrode, and first wiring lines. The common electrode is electrically connected to cathodes of the light emitting elements, and electrically connected to the contact electrodes of the pixels. The first wiring lines, each provided between the first organic insulating layer and the second organic insulating layer or between the second organic insulating layer and the resin layer, are electrically connected to the contact electrodes of the pixels, and are formed of a metal.

A display device is disclosed. The display device includes a substrate and a LED device. The substrate includes a translucent body and a conductive wire layer. The translucent body has a translucent body first surface. The conductive wire layer is disposed on the translucent body first surface. The LED device includes a base and a LED chip. The base is disposed on the other side of the conductive wire layer with respect to the translucent body and is coupled with the conductive wire layer. The base has a base first surface facing the translucent body first surface. The LED chip is disposed on the base first surface.

A display device is disclosed. The display device includes a substrate and a LED device. The substrate includes a translucent body and a conductive wire layer. The translucent body has a translucent body first surface. The conductive wire layer is disposed on the translucent body first surface. The LED device includes a base and a LED chip. The base is disposed on the other side of the conductive wire layer with respect to the translucent body and is coupled with the conductive wire layer. The base has a base first surface facing the translucent body first surface. The LED chip is disposed on the base first surface.

A method for manufacturing a light-emitting device, comprising: forming, over a substrate, a plurality of multilayered light-emitting structures each including a first electrode, a light-emitting layer, and a second electrode; forming, in the substrate, a plurality of grooves that surround the multilayered light-emitting structures individually; forming, over the substrate, a sealing film that covers the multilayered light-emitting structures and the grooves; and separating the multilayered light-emitting structures from one another after forming the sealing film, by cutting the substrate such that, in each groove, part of the sealing film covering a given inner side surface of the groove remains, the given inner side surface being adjacent to any of the multilayered light-emitting structures.

A method for manufacturing a light-emitting device, comprising: forming, over a substrate, a plurality of multilayered light-emitting structures each including a first electrode, a light-emitting layer, and a second electrode; forming, in the substrate, a plurality of grooves that surround the multilayered light-emitting structures individually; forming, over the substrate, a sealing film that covers the multilayered light-emitting structures and the grooves; and separating the multilayered light-emitting structures from one another after forming the sealing film, by cutting the substrate such that, in each groove, part of the sealing film covering a given inner side surface of the groove remains, the given inner side surface being adjacent to any of the multilayered light-emitting structures.

A light emitting device includes a substrate, a light emitting element, and a light reflecting member. The substrate includes a pair of connection terminals on a first main surface. The light emitting element is connected to the connection terminals by a molten material. The light reflecting member covers the light emitting element. The connection terminals each has a protruding portion at a position connected to the light emitting element over the first main surface of the substrate, the protruding portion protruding toward the light emitting element. The molten material covers a side surface of the protruding portion of each of the connection terminals. The protruding portion of each of the connection terminals, the molten material, and a space between the substrate and the light emitting element are embedded by the light reflecting member.

A light emitting device includes a substrate, a light emitting element, and a light reflecting member. The substrate includes a pair of connection terminals on a first main surface. The light emitting element is connected to the connection terminals by a molten material. The light reflecting member covers the light emitting element. The connection terminals each has a protruding portion at a position connected to the light emitting element over the first main surface of the substrate, the protruding portion protruding toward the light emitting element. The molten material covers a side surface of the protruding portion of each of the connection terminals. The protruding portion of each of the connection terminals, the molten material, and a space between the substrate and the light emitting element are embedded by the light reflecting member.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.