H01L33/36

SEMICONDUCTOR DEVICE
20200152830 · 2020-05-14 ·

A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure and a light-emitting structure. The light-emitting structure is located between the first semiconductor structure and the second semiconductor structure. The light-emitting structure includes a multiple quantum well structure. The multiple quantum well structure contains aluminum and includes a plurality of semiconductor stacks. Each of the semiconductor stacks is stacked by a well layer and a barrier layer. In each semiconductor stack, the well layer has a thickness larger than a thickness of the barrier layer.

Display body device and display apparatus with improved electrostatic withstanding voltage

To provide a display body device and a display apparatus that allow for improvement of an electrostatic withstanding voltage, a display body device 10E includes: a wiring substrate 30; a light-emitting element 12 and a drive IC 13 that are disposed on the wiring substrate 30; and a wiring pattern 36 that is disposed on an outermost side, and is at least partially exposed and has a potential equal to a ground of each of the light-emitting element 12 and the drive IC 13.

Display body device and display apparatus with improved electrostatic withstanding voltage

To provide a display body device and a display apparatus that allow for improvement of an electrostatic withstanding voltage, a display body device 10E includes: a wiring substrate 30; a light-emitting element 12 and a drive IC 13 that are disposed on the wiring substrate 30; and a wiring pattern 36 that is disposed on an outermost side, and is at least partially exposed and has a potential equal to a ground of each of the light-emitting element 12 and the drive IC 13.

Open-mode protection device and electronic device having same

Provided are an open-mode protection device and an electronic device having the same. An open-mode protection device according to an embodiment of the present invention is connected in parallel to each of a constant current source and a load configured with a light emitting diode (LED). The open-mode protection device comprises a first external electrode connected to one sides of the constant current source and the load; a second external electrode connected to the other sides of the constant current source and the load, and a ground; a protection unit configured to bypass, to the ground through the second external electrode, an overvoltage or an overcurrent flowing into the first external electrode; and a current suppressing unit connected in series to the protection unit and configured to sense a temperature or current of the protection unit and reduce the current of the protection unit as the temperature or current increases.

SURFACE LIGHT-EMITTING LED
20200144452 · 2020-05-07 ·

A surface light-emitting LED, including an LED chip and a metal support. The metal support includes a first support and a second support in planar shapes. The LED chip is fixed to the second support, and two electrodes of the LED chip are respectively connected to the first support and the second support by wires. An epoxy layer is provided on the first support and the second support. A gap between the first support and the second support is filled with the epoxy layer. The LED of the present invention emits light in all directions, improving illumination of the LED.

SURFACE LIGHT-EMITTING LED
20200144452 · 2020-05-07 ·

A surface light-emitting LED, including an LED chip and a metal support. The metal support includes a first support and a second support in planar shapes. The LED chip is fixed to the second support, and two electrodes of the LED chip are respectively connected to the first support and the second support by wires. An epoxy layer is provided on the first support and the second support. A gap between the first support and the second support is filled with the epoxy layer. The LED of the present invention emits light in all directions, improving illumination of the LED.

Display device with separation member including steps
10644052 · 2020-05-05 · ·

A display device includes: a substrate; a plurality of light-emission elements arranged, on the substrate, in a first direction and a second direction intersecting each other, each of the light-emission elements having a first electrode layer, an organic layer including a luminous layer, and a second electrode layer which are laminated in that order; and a separation section disposed, on the substrate, between the light-emission elements adjacent to each other in the first direction, the separation section having two or more pairs of steps. The first electrode layers in the light-emission elements are separated from each other, and the organic layers as well as the second electrode layers in the light-emission elements adjacent to each other in the first direction are separated from each other by the steps included in the separation section.

Display device with separation member including steps
10644052 · 2020-05-05 · ·

A display device includes: a substrate; a plurality of light-emission elements arranged, on the substrate, in a first direction and a second direction intersecting each other, each of the light-emission elements having a first electrode layer, an organic layer including a luminous layer, and a second electrode layer which are laminated in that order; and a separation section disposed, on the substrate, between the light-emission elements adjacent to each other in the first direction, the separation section having two or more pairs of steps. The first electrode layers in the light-emission elements are separated from each other, and the organic layers as well as the second electrode layers in the light-emission elements adjacent to each other in the first direction are separated from each other by the steps included in the separation section.

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200135801 · 2020-04-30 ·

A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200135801 · 2020-04-30 ·

A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.