A system and method providing correlated color temperature-tunable (CCT-tunable) white light using a laser diode(s) in conjunction with a III-Nitride nanowires-based LED element grown on a semi-transparent substrate. The tunability spans across yellow, amber, and red wavelengths and can be implemented by current injection. The current-dependent broad wavelength tunability enables control of wide range of CCT values (intensity, peak wavelength, and spectral coverage). The broad coverage in the yellow-amber-red color regime mimics that of a passive yellow phosphor, while the injection of current into the LED element defines an active phosphor element. The semi-transparent active phosphor element allows direct transmission of light from a laser diode(s) for achieving extreme wide tunability of CCT.

A light-emitting device includes a light emitting element having a pad electrode, and a metal member connected to the pad electrode via a wire. The wire has a layered structure including at least a core material containing copper as a main component, an intermediate layer containing palladium as a main component, and a surface layer containing silver as a main component. The intermediate layer is arranged between the core material and the surface layer.

A light-emitting device includes a light emitting element having a pad electrode, and a metal member connected to the pad electrode via a wire. The wire has a layered structure including at least a core material containing copper as a main component, an intermediate layer containing palladium as a main component, and a surface layer containing silver as a main component. The intermediate layer is arranged between the core material and the surface layer.

The present disclosure relates to a driving backplane, a micro-LED display panel and a micro-LED display device. The driving backplane, includes a plurality of pixel units arranged in an array, each of the pixel units comprising: an anode lead; a cathode lead at a side of the anode lead; and at least two pairs of electrodes, each pair of electrodes of the at least two pairs of electrodes including an anode and a cathode oppositely disposed, the anode being electrically connected to the anode lead, and the cathode being electrically connected to the cathode lead. In the course of using the foregoing driving backplane of the micro-LED display panel, it is only necessary to solder an LED chip on one pair of electrodes of the at least two pairs of electrodes.

An electroluminescent device including an anode and a cathode facing each other, an emission layer disposed between the anode and the cathode, the emission layer including quantum dots, a hole auxiliary layer disposed between the emission layer and the anode and an electron auxiliary layer disposed between the emission layer and the cathode, wherein the electroluminescent device is configured such that electrons are dominant in the emission layer and a logarithmic value (log (HT/ET)) of a hole transport capability (HT) relative to an electron transport capability (ET) is less than or equal to about 1, or the electroluminescent device is configured such that holes are dominant in the emission layer and the logarithmic log value (log (HT/ET)) of the hole transport capability (HT) relative to the electron transport capability (ET) is greater than or equal to about 0.5.

An electroluminescent device including an anode and a cathode facing each other, an emission layer disposed between the anode and the cathode, the emission layer including quantum dots, a hole auxiliary layer disposed between the emission layer and the anode and an electron auxiliary layer disposed between the emission layer and the cathode, wherein the electroluminescent device is configured such that electrons are dominant in the emission layer and a logarithmic value (log (HT/ET)) of a hole transport capability (HT) relative to an electron transport capability (ET) is less than or equal to about 1, or the electroluminescent device is configured such that holes are dominant in the emission layer and the logarithmic log value (log (HT/ET)) of the hole transport capability (HT) relative to the electron transport capability (ET) is greater than or equal to about 0.5.

A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is larger than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view.

A light emitting device includes a substrate, a light emitting element, and a plurality of bumps. The light emitting element is mounted on the substrate. The bumps connect the substrate and the light emitting element. The bumps are arranged in a plurality of columns extending parallel to one side of an outer edge of the light emitting element. A distance between adjacent ones of the bumps in one of the columns arranged closest to the outer edge of the light emitting element is larger than a distance between adjacent ones of the bumps arranged on an inner side of the light emitting element in a plan view.

A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.

A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.