H01L33/36

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200083281 · 2020-03-12 ·

A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200083281 · 2020-03-12 ·

A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200083280 · 2020-03-12 ·

A microLED display includes a first main substrate, micrLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

TOP EMISSION MICROLED DISPLAY AND BOTTOM EMISSION MICROLED DISPLAY AND A METHOD OF FORMING THE SAME
20200083280 · 2020-03-12 ·

A microLED display includes a first main substrate, micrLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

Access resistance modulated solid-state light source

A solid-state light source with built-in access resistance modulation is described. The light source can include an active region configured to emit electromagnetic radiation during operation of the light source. The active region can be formed at a p-n junction of a p-type side with a p-type contact and a n-type side with a n-type contact. The light source includes a control electrode configured to modulate an access resistance of an access region located on the p-type side and/or an access resistance of an access region located on the n-type side of the active region. The solid-state light source can be implemented in a circuit, which includes a voltage source that supplies a modulation voltage to the control electrode to modulate the access resistance(s).

Access resistance modulated solid-state light source

A solid-state light source with built-in access resistance modulation is described. The light source can include an active region configured to emit electromagnetic radiation during operation of the light source. The active region can be formed at a p-n junction of a p-type side with a p-type contact and a n-type side with a n-type contact. The light source includes a control electrode configured to modulate an access resistance of an access region located on the p-type side and/or an access resistance of an access region located on the n-type side of the active region. The solid-state light source can be implemented in a circuit, which includes a voltage source that supplies a modulation voltage to the control electrode to modulate the access resistance(s).

Light emitting device with an electrostatic discharge (ESD) suppression pattern having first and second conductive particles dispersed in a resin

One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

Light emitting device with an electrostatic discharge (ESD) suppression pattern having first and second conductive particles dispersed in a resin

One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

Light emitting device and LED package structure
10588184 · 2020-03-10 · ·

A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.

Light emitting device and LED package structure
10588184 · 2020-03-10 · ·

A light-emitting device including a substrate, plural light-emitting units, and a sealing member is disclosed. The substrate includes plural electrode pads. The light-emitting units are disposed on the substrate and each include an LED chip. The LED chips are electrically connected with the electrode pads. The sealing member is disposed on the substrate, covers a side surface of each of the light-emitting units, and includes a surrounding portion surrounding the light-emitting units and a separating portion disposed between the light-emitting units. An LED package structure including the aforementioned substrate, light-emitting units, and sealing member is also disclosed. The light-emitting units can generate light of different colors or color temperatures and allow adjustment of the colors or color temperatures.