The invention relates to a device and a method for the alignment of substrates.

A semiconductor chip bonding device may include a substrate support, a bonding head moveable in a first direction toward the substrate support, and a sealing member disposed on the bonding head and surrounding a circumferential surface of the bonding head and extending in the first direction from the bonding head toward the substrate support and movable in the first direction.

A bonding method includes: preparing a first semiconductor substrate having a first surface and a second semiconductor substrate having a second surface; hydrophilizing the first surface of the first semiconductor substrate and the second surface of the second semiconductor substrate; bonding the first surface of the first semiconductor substrate and the second surface of the second semiconductor substrate after the hydrophilizing; and bonding the first surface of the first semiconductor substrate and the second surface of the second semiconductor substrate after the hydrophilizing. The enhancing of the bonding strength includes performing heat treatment on the first semiconductor substrate and the second semiconductor substrate in a first temperature range; and performing heat treatment on the first semiconductor substrate and the second semiconductor substrate at a target temperature after the performing of the heat treatment in the first temperature range. The first temperature range is lower than the target temperature.

A bonding device includes a stage supporting a bonding target, a lower transmission member adjacent to the stage in a first direction, an upper transmission member spaced apart from the lower transmission member in the first direction, a chamber between the lower transmission member and the upper transmission member, and partially defining an internal space for accommodating air, a thin film between the chamber and the lower transmission member, defining the internal space together with the chamber, and configured to be deformed according to expansion of the internal space as the air is introduced, and a vertical movement member configured to move the lower transmission member in the first direction, and separable from the lower transmission member.

An object of the disclosure is to provide a technique that enables surface activated bonding between a die and a substrate, and, a die bonding apparatus includes: a first bonding head that picks up a die; a first bonding stage that holds a substrate; and a plasma irradiator that irradiates, with plasma, the surface of the die picked up by the first bonding head and the surface of the substrate held by the first bonding stage.

A wire bonding capillary made of materials of differing hardness.

A semiconductor package manufacturing apparatus is provided and includes a bonding head including at least one vacuum hole, and at least one adsorption trench in a lower surface of the bonding head and connected to the at least one vacuum hole. A lower part of the bonding head includes at least one first portion, and a second portion spaced apart from the at least one first portion and surrounding the at least one first portion in a plan view. The at least one adsorption trench is defined by and between the at least one first portion and the second portion, and at least a portion of an inner surface of the at least one adsorption trench and at least a portion of an outer surface of the at least one adsorption trench are curved in the plan view.

A system for holding a first set of die during a first placement operation onto a substrate and placing a second set of additional die onto the same substrate during a second placement operation. The first set of die have a different height than the second set of die and the sets of die may comprise an entire wafer of die. A stretchable mounting film has an adhesive to which a set of die and a frame attach. The frame has an open center portion formed by two or more outer support rail sections that are expandable to an expanded position. An optional frame lock may secure the frame in the expanded position. The frame and mounting tape can be expanded along a first axis, a second axis, or both, which separates the die adhesively attached to the mounting film.

A bonding method includes providing a source substrate, the source substrate includes active side alignment marks on an active side of the source substrate, first non-active side alignment marks and second non-active side alignment marks on a non-active side of the source substrate, and obtaining positions of the active side alignment marks and positions of the first non-active side alignment marks of the source substrate, and determining alignment marks placement errors based on offsets between the positions of the active-side alignment marks and the positions of the first non-active side alignment marks in the X, Y, and directions.

A positioning equipment includes a camera, a lens disposed in an imaging direction of the camera, a light synthesis unit, and an arithmetic equipment. The light synthesis unit is disposed between a bonding head and a stage when a first component and a second component are positioned, synthesizes light incident from the bonding head side and light incident from the stage side, and reflects the synthesized light to the lens side. The camera images a camera image based on light incident via the lens. The arithmetic equipment obtains a position correction amount between the first component and the second component based on the camera image.