An apparatus for stacking chips includes a bonding base moved to transfer and stack a chip and an attachment element disposed on a bottom of the bonding base and adsorbing the chip, wherein the attachment element includes a cavity through which air flows in and out to change the shape of the adsorbed chip, and the attachment element is deformed so that the chip gradually comes into contact with the buffer eventually in the entire surface of chip, starting from a center of the chip toward an edge of the chip, and then deformed so that only the edge of the chip is in contact with the buffer.

According to one embodiment, a wire bonding apparatus includes a bonding tool configured to feed a wire, a driver configured to drive the bonding tool, and a controller. The controller performs a bonding process of causing a ball formed at a tip of the wire to contact a first bonding point, deforming the ball into a bump, and bonding the bump to the first bonding point. The controller further performs a lowering process of raising the bonding tool while the bonding tool holds the wire connected with the bump, changing a position of the bonding tool in a horizontal direction, and subsequently lowering the bonding tool toward the first bonding point. The controller determines a goodness of the bonding of the bump to the first bonding point based on a detected value detected in the lowering process, the detected value being prescribed.

A pressure sintering method and apparatus are provided for attaching a component to a substrate with a sintering material there between by pressure sintering at a sintering pressure and a sintering temperature during a pressure sintering time interval. The pressure sintering apparatus comprising a first tool part and a second tool part that is configured to hold the substrate, and the first tool part and the second tool part are arranged to be movable with respect to one another in between an open configuration, for receiving the component and the substrate inbetween the first tool part and the second tool part, and a closed configuration, for holding the component and the substrate between and in contact with the first tool part and the second tool part with the sintering material between and in contact with the component and the substrate to apply the sintering pressure to the component, the sintering material and the substrate.

A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bond head assembly for bonding a wire to a workpiece and a support structure for supporting the workpiece. The wire bonding array also includes a wire bonding tool replacement system configured for installation on, and removal from, each of the plurality of wire bonding systems. The wire bonding array also includes a service robot configured to install the wire bonding tool replacement system on, and remove the wire bonding tool replacement system from, each of the plurality of wire bonding systems.

According to one embodiment, a controller of a wire bonding apparatus is configured to calculate a height of a bump based on a diameter of a ball-shaped portion detected by a diameter detecting part, a first position of a bonding tool detected by a position detecting part when a load sensor detects a load at a first bonding point, and a second position of the bonding tool when the bonding tool is lowered at the first bonding point, and to bond a wire based on the calculated height of the bump.

According to one embodiment, a controller of a wire bonding apparatus is configured to calculate a height of a bump based on a diameter of a ball-shaped portion detected by a diameter detecting part, a first position of a bonding tool detected by a position detecting part when a load sensor detects a load at a bonding point, and a second position of the bonding tool when the bonding tool is lowered most at the bonding point, and to bond a wire based on the calculated height of the bump. The controller is further configured to acquire a plurality of the first positions of a plurality of the bumps formed on a chip, and to calculate a relative positional relationship of the plurality of first positions.

A method of monitoring gas byproducts of a bonding system is provided. The method includes: providing a plurality of bonding systems, each of the bonding systems including a reducing gas delivery system for use in connection with a bonding operation, each of the bonding systems being configured for exhausting gas byproducts; connecting each of the bonding systems to a monitoring device using a respective gas delivery path; and monitoring a composition of at least a portion of the gas byproducts with the monitoring device.

A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface having the substrate placed thereon; and a conforming jig which has a conforming surface onto which the chip holding surface is pressed, and in which the inclination of the conforming surface can be changed such that the inclination of the chip holding surface corresponds to the inclination indicated by the inclination information.

A bonding head according to some embodiments of the present disclosure may include: a double-acting air bearing cylinder configured to move a cylinder rod in a vertical direction; a first scale on a same axis as the cylinder rod and having a first encoder pattern; a first encoder sensor configured to decipher a position of the first encoder pattern; a second scale on the same axis as the cylinder rod and having a second encoder pattern; a second encoder sensor configured to decipher a position of the second encoder pattern; a shaft motor on the same axis as the cylinder rod and configured to move the cylinder rod in the vertical direction based on a deciphering result of the first encoder sensor, and a piezo motor on the same axis as the cylinder rod and configured to move the cylinder rod in a rotation direction.

A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.