A display device and a method of manufacturing the display device are provided. The display device includes pixels and a bank including an opening overlapping each of the pixels in a plan view, light emitting elements disposed in the pixels, a color conversion layer disposed on the light emitting elements in the opening of the bank, and an optical layer disposed on the color conversion layer in the opening of the bank. The optical layer includes an organic layer surrounding voids of the optical layer.

A light-emitting semiconductor component may include a semiconductor body having an active region configured to emit a primary radiation, a first conversion element to convert the primary radiation to a first secondary radiation, a second conversion element to convert the primary radiation to a second secondary radiation, and a mask. The first conversion element and the second conversion element may be arranged at a top side of the semiconductor body, may be configured as bodies that partly cover the semiconductor body, and may be connected to the semiconductor body. The mask may be arranged between the first conversion element, the second conversion element, and the semiconductor body. The mask may have an opening in the region of each conversion element.

A device comprising a light emitting diode (LED) substrate, and a meta-molecule wavelength converting layer positioned within an emitted light path from the LED substrate, the a meta-molecule wavelength converting layer including a plurality of nanoparticles, the plurality of nanoparticles configured to increase a light path length in the wavelength converting layer.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

A display device may include: a substrate; first and second electrode on the substrate; light emitting element between the first and second electrodes; a barrier structure on the substrate and including a first surface, a second surface, and a third surface; a light conversion layer on the barrier structure; and a passivation layer on the light conversion layer. A first space defined by the second and third surfaces may be between the substrate and the barrier structure. A second space defined by the first and second surfaces may be between the barrier structure and the passivation layer. The first and second spaces may be alternately located in the first direction. The light emitting element may be in the first space. The light conversion layer may be in the at least one second space.

A display panel and a manufacturing method of the display panel are provided. The display panel includes: a first substrate, a second substrate disposed opposite to the first substrate, a driving circuit disposed opposite to the first substrate and adjacent to a side of the second substrate, and a color resist layer disposed opposite to the driving circuit and adjacent to a side of the first substrate; wherein the color resist layer includes colorized color resist layers and a colorized quantum dot layer, and the driving circuit is a bottom-emission type light-emitting-diode (LED) driving circuit.

A light emitting module includes a board, light sources, first and second wirings, and an insulating member. Each of the light sources includes first and second electrodes exposed from an upper side. The first wiring includes first extending portions and first connecting portions. The second wiring includes second extending portions and second connecting portions. The insulating member covers the first wiring and the second extending portions of the second wiring while a portion of each of the second extending portions of the second wiring is exposed from the insulating member through a corresponding one of the openings. The second connecting portions of the second wiring are arranged on or above a part of the insulating member positioned on or above the first connecting portions of the first wiring. The second connecting portions of the second wiring are respectively connected to the second extending portions at the openings.

A display device may include a light emitting element including a first end having a first surface, and a second end having a second surface parallel to the first surface, an organic pattern that overlaps the light emitting element and exposes the first and second surfaces, a first electrode disposed on a substrate and electrically contacting the first end, and a second electrode disposed on the substrate and spaced apart from the first electrode, and electrically contacting the second end. A surface area of the first surface may be less than that of the second surface. A top surface of the organic pattern may be a curved surface.

A structure and method of micro-LEDs are described. The micro-LEDs have a GaN semiconductor structure containing a multi-quantum well active region configured to emit light of a visible wavelength range and a structure to increase specular reflection of ambient light by proving scattering at one or more interfaces of the micro-LEDs. The interfaces include the air-encapsulant interface, semiconductor-encapsulant interface, or semiconductor-contact interface.

A display device includes a first pixel, a second pixel, and a third pixel, bank patterns disposed on a substrate, light-emitting elements disposed between the bank patterns, color conversion layers disposed on the light-emitting elements between the bank patterns, and protective layers disposed on the color conversion layers, wherein the protective layers in the first pixel, the second pixel, and the third pixel have different thicknesses.