Disclosed are a color conversion structure, a display apparatus, and a method of manufacturing the display apparatus. The color conversion structure has a transferable film structure which includes a base layer and a quantum dot layer provided on the base layer.

A light-emitting device of the present invention includes a plurality of substrates, an insulating portion, and an insulating upper surface coating film. The plurality of metal substrates are placed side by side to be separated from one another. The insulating portion is made of ceramic and fills the clearance. The insulating upper surface coating film is formed so as to integrally cover respective one substrate surfaces of the plurality of substrates and has an opening portion that spreads over the one substrate surface of one substrate among the plurality of substrates and the one substrate surface of another substrate adjacent to the one substrate across the clearance. The opening portion exposes an element placing region for placing an element.

An apparatus can include a lens that can shape light emerging from a light emitting diode (LED). The emergent light from the LED can be substantially centered around an LED axis. An incident surface of the lens can be positioned to face the LED. The incident surface can include a concave portion. The concave portion can be substantially smooth, so as not to substantially scatter light that strikes the concave portion. The concave portion can be substantially centered around a concave portion axis that is non-coaxial with the LED axis. The incident surface can include a scattering portion, positioned away from the concave portion, which can be textured so as to scatter light that strikes the scattering portion. An exiting surface of the lens can optionally include a generally planar portion that at least partially surrounds a substantially smooth convex portion.

Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer portions arranged on or over a light-transmissive substrate. The active layer portions are configured to illuminate different light-transmissive substrate portions to form pixels. Various enhancements may beneficially provide increased contrast (i.e., reduced cross-talk between pixels) and/or promote inter-pixel illumination homogeneity, without unduly restricting light utilization efficiency. In some aspects, an underfill material with improved surface coverage is provided between adjacent pixels of a pixelated-LED chip. The underfill material may be arranged to cover all lateral surfaces between the adjacent pixels. In some aspects, discontinuous substrate portions are formed before application of underfill materials. In some aspects, a wetting layer is provided to improve wicking or flow of underfill materials during various fabrication steps. Other technical benefits may additionally or alternatively be achieved.

Micro light-emitting diode displays and methods of fabricating micro LED displays are described. In an example, a micro light emitting diode pixel structure includes a plurality of micro light emitting diode devices in a dielectric layer. Each of the micro light emitting diode devices have Mie scattering particles thereon. A transparent conducting oxide layer is above the dielectric layer and on the Mie scattering particles. A binder material layer is above the transparent conducting oxide layer. The binder material layer has a plurality of Rayleigh scattering particles therein.

A light emitting device includes light emitting elements, light-transmissive members, a covering member, at least one first protrusion, and two second protrusions. The light emitting elements are aligned in a first direction. The light-transmissive members are respectively disposed on upper surfaces of the light emitting elements. The covering member includes at least one first covering portion and two second covering portions. The at least one first covering portion is arranged between adjacent ones of the light-transmissive members, and the second covering portions are arranged at distal ends of the light emitting device in the first direction with the light-transmissive members being arranged between the second covering portions. The at least one first protrusion is arranged on an upper surface of the at least one first covering portion and being spaced apart from the light-transmissive members. The second protrusions respectively arranged on upper surfaces of the second covering portions.

A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

Multiple first recesses are formed on the side of an inorganic insulating layer facing towards multiple LEDs. Orthographic projections of the first recesses on a driving substrate do not overlap orthographic projections of the LEDs on the driving substrate. Thus, when a first planarization layer covering the multiple LEDs is formed on the side of the multiple LEDs facing away from the driving substrate, the first recesses can be filled with the first planarization layer, so that a contact area between the first planarization layer and the inorganic insulating layer can be increased, a binding force between the first planarization layer and the inorganic insulating layer can be increased, and the risk of peeling off the first planarization layer can be reduced, thereby improving the stability of a QD-LED device.

A tiled display device includes a first display substrate including a plurality of light emitting areas defined by one or more banks, a second display substrate adjacent to the first display substrate and including a plurality of light emitting areas, a coupling member coupling the first display substrate and the second display substrate, and a color conversion substrate including a plurality of light transmitting areas corresponding to the plurality of light emitting areas of each of the first display substrate and the second display substrate, and a plurality of light blocking areas between the plurality of light transmitting areas and corresponding to the one or more banks or the coupling member.

A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.