A tiling display device includes a first display panel and a second display panel that is spaced apart from the first display panel by a horizontal tiling interval. The first display panel includes first to (n)-th pixel columns, and the second display panel includes first to (m)-th pixel columns. A first distance between the (n)-th pixel column of the first display panel and the first pixel column of the second display panel is less than a second distance between a (n−1)-th pixel column of the first display panel and the (n)-th pixel column of the first display panel.

A reflective and heat-insulating QLED package device and a method for packaging the same as well as a luminaire are provided. The reflective and heat-insulating QLED package device includes a substrate, a first LED chip for emitting blue light, a second LED chip for emitting green light, an adhesive layer for quantum dots, a reflecting layer for changing the path of light rays, and a heat-insulating layer. The first LED chip and the second LED chip are arranged on the substrate in a tiled manner. The heat-insulating layer is arranged on the light output surface of the first LED chip and the second LED chip, a reflecting layer covers the heat-insulating layer, and a reflecting substance or a refractive substance is uniformly distributed in the reflecting layer. The adhesive layer for quantum dots covers the reflecting layer and is covered by a moisture and oxygen blocking adhesive layer.

A light emitting device includes: a light emitting element having a dominant wavelength in a range greater than or equal to 380 nm and less than or equal to 470 nm; a wavelength conversion member that is disposed on the light emitting element and includes: a translucent member, and a first fluorescent material layer interposed between the light emitting element and the translucent material, the first fluorescent material layer comprising a resin that contains a first fluorescent material, and the first fluorescent material comprising at least one compound selected from (Ca, Sr)AlSiN.sub.3: Eu and (Ca, Sr, Ba).sub.2Si.sub.5N.sub.8: Eu; and a covering member that covers sides of the wavelength conversion member and surrounds the light emitting element, the covering member comprising light reflecting material and a second fluorescent material, and the second fluorescent material comprising at least one compound selected from (Ca, Sr)AlSiN.sub.3: Eu and (Ca, Sr, Ba).sub.2Si.sub.5N.sub.8: Eu.

A light source module includes a substrate, a light emitting device, a package structure, and an optical pattern. The light emitting device and the package structure are disposed on a surface of the substrate, and the package structure covers the light emitting device. The package structure has a first groove and a second groove connected to each other. The light emitting device is located between the first grove and the substrate. The second groove is located between the first groove and the substrate. An orthogonal projection of the region occupied by the first groove on the substrate has a geometric center. The light emitting device is located at the geometric center. An orthogonal projection of the region occupied by the second groove on the substrate does not overlap the geometric center. The optical pattern is disposed in the first groove and the second groove, and is transflective.

An ink composition is provided. The composition includes a binder material and at least one narrow band emission phosphor being uniformly dispersed throughout the composition, wherein the narrow band emission phosphor has a D50 particle size from about 0.1 μm to about 15 μm and is selected from the group consisting of a green-emitting U.sup.6+-containing phosphor, a green-emitting Mn.sup.2+-containing phosphor, a red-emitting phosphor based on complex fluoride materials activated by Mn.sup.4+, and a mixture thereof. A device is also provided.

A light emitting device includes a light emitting element, a light-transmissive member, a bonding member and a light-reflective member. The bonding member is disposed between the light emitting element and the light-transmissive member, with the bonding member covering an upper surface of the light emitting element and at least a part of a lateral surface of the light emitting element. The light-reflective member covers the bonding member and a lateral surface of the light-transmissive member. The bonding member includes a surface that is flush with the lateral surface of the light-transmissive member, and an inclined surface that is inclined so as to extend toward the light-transmissive member.

A display device includes a bank including an opening defining a plurality of pixels; a plurality of light emitting elements disposed in the plurality of pixels; a color conversion layer disposed on the plurality of light emitting elements in the opening; and a low refractive layer disposed on the color conversion layer in the opening.

A unit pixel is provided. The unit pixel includes a transparent substrate, a first light blocking layer disposed on the transparent substrate and having windows that transmit light, an adhesive layer covering the first light blocking layer, a plurality of light emitting devices disposed on the adhesive layer to be arranged on the windows, and a second light blocking layer covering side surfaces of the light emitting devices.

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.