In an end surface 32b of the second transmission line forming body 32 forming a second waveguide 30, the height of a central region 33 which includes an opening of the second transmission line 30b is a reference plane. A depressed portion 32e that is depressed to a depth greater than the length of a thread portion of a screw 205 from the reference plane is provided in a region outside the central region 33 and includes a screw hole forming position. A screw hole 32d for fixing an external circuit 200 to be connected is provided at the screw hole forming position in the depressed portion 32e. The height of a region, which is excluding the depressed portion 32e and is further away from the central region 33 than the screw hole forming position, is equal to the reference plane.

A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.

A wireless communication system including an electrically conductive passive medium capable of simultaneously propagating therealong electromagnetic first and second currents at different respective frequencies F1 and F2, the electrically conductive passive medium including an electrically conductive first passive linear medium portion adjacent an electrically conductive first passive nonlinear medium portion, the first passive nonlinear medium portion capable of generating an intermodulation current based on a nonlinear interaction between the first and second currents, the intermodulation current having a frequency Fi equal to nF1+mF2 and propagating along the first passive nonlinear medium portion, m and n being positive or negative integers; and a first magnetic film disposed proximate an electrically conductive external surface of the first linear medium portion, such that when the first and second currents propagate along the first passive linear medium portion toward the first passive nonlinear medium portion, the magnetic film reduces or prevents the generation of the intermodulation current in the first passive nonlinear medium portion by attenuating at least portions of the first and second currents.

A terminal connection comprises an HF conductor and a terminal apparatus. The terminal apparatus comprises an HF conductor receiving element comprising an HF conductor receiving hole. At least one solder deposit is arranged between the HF conductor and the HF conductor receiving element of the terminal apparatus to establish an electrically conductive connection. There is also an insertion sleeve comprising a receiving opening into which the HF conductor is inserted. The insertion sleeve is inserted into the HF conductor receiving hole in the HF conductor receiving element via an insertion opening on the plug-in side. The insertion sleeve is undeformable and/or is formed from a dielectric. It may also be adapted, in terms of the circumferential lateral face thereof, to an inner face of the HF conductor receiving hole. It may also comprise a receiving channel, which is used for receiving the at least one solder deposit.

Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

Embodiments of the present disclosure perform incisions along the direction of the long axis of the waveguide, thereby exposing a trench structure which can be readily plated. Once divided and plated, the individual cut pieces can then be secured together to restore the original waveguide structure. In this fashion, multiple cut pieces can be secured together and used as “building blocks” to create a modular solution which can be used to provide a number of different customizable waveguide structures. Thus, embodiments of the present disclosure perform plating procedures in a less expensive manner while achieving the benefits of ganged waveguide structures. Moreover, embodiments of the present disclosure offer a modular approach to ganged waveguide design thereby allowing for end-user flexibility in testing.

A waveguide adapter assembly for coupling a waveguide to an apparatus comprises a waveguide adapter having an adapter body, having a first end, a second end and a cavity therein. The cavity has a first opening in the first end for receiving an end portion of a waveguide and a second opening in the second end for communicating with a corresponding opening in the apparatus. The second end has a face around the second opening for mating with a corresponding surface of the apparatus. A flange assembly has a first end and a second end for connecting to the apparatus, with a bore therethrough for receiving the waveguide adaptor. In a further arrangement, the adapter assembly comprises an adapter body for receiving an end portion of a waveguide and for connecting to the apparatus; and means for biasing the adapter body into contact with a mating surface of the apparatus.

A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.