The invention relates to a transition from a stripline to a waveguide, wherein: the stripline, preferably a microstrip line, is located on a substrate; an upper side of the substrate has a metallised surface and the lower side of the substrate has a metal layer, preferably a high-frequency ground-potential layer; the upper side and the lower side are connected to vias; and at least part of the metallised surface on the upper side of the substrate acts as a waveguide wall.

The invention relates to a transition from a stripline to a waveguide, wherein: the stripline, preferably a microstrip line, is located on a substrate; an upper side of the substrate has a metallised surface and the lower side of the substrate has a metal layer, preferably a high-frequency ground-potential layer; the upper side and the lower side are connected to vias; and at least part of the metallised surface on the upper side of the substrate acts as a waveguide wall.

An exemplary medical system includes a first electrical circuit on a printed circuit board (PCB) and configured to generate data, a second electrical circuit on the PCB and electrically isolated from the first electrical circuit, and a radio frequency (RF) communication interface assembly on the PCB. The RF communication interface assembly includes an RF transmitter electrically coupled to the first electrical circuit and electrically isolated from the second electrical circuit, an RF receiver out of direct RF signal path alignment with the RF transmitter, electrically coupled to the second electrical circuit, and electrically isolated from the first electrical circuit, and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of the data between the RF transmitter and the RF receiver.

An exemplary medical system includes a first electrical circuit on a printed circuit board (PCB) and configured to generate data, a second electrical circuit on the PCB and electrically isolated from the first electrical circuit, and a radio frequency (RF) communication interface assembly on the PCB. The RF communication interface assembly includes an RF transmitter electrically coupled to the first electrical circuit and electrically isolated from the second electrical circuit, an RF receiver out of direct RF signal path alignment with the RF transmitter, electrically coupled to the second electrical circuit, and electrically isolated from the first electrical circuit, and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of the data between the RF transmitter and the RF receiver.

The present disclosure relates to waveguide band-stop filter arrangement adapted to be connected to a waveguide transmission line at a filter interface, where the waveguide transmission line is adapted for a main propagation extension. The band-stop filter arrangement comprises a first pair of cavities, where each cavity in the first pair, each first pair cavity, comprises a corresponding inductive first pair aperture arrangement that is adapted to connect the corresponding first pair cavity to the waveguide transmission line. The first pair cavities are positioned adjacent each other along a stacking extension perpendicular to the main propagation extension such that they share a first common wall and are adapted to be positioned adjacent the waveguide transmission line. The first pair of cavities comprises a first capacitive aperture arrangement in the first common wall, mutually connecting the first pair cavities.

The present disclosure relates to waveguide band-stop filter arrangement adapted to be connected to a waveguide transmission line at a filter interface, where the waveguide transmission line is adapted for a main propagation extension. The band-stop filter arrangement comprises a first pair of cavities, where each cavity in the first pair, each first pair cavity, comprises a corresponding inductive first pair aperture arrangement that is adapted to connect the corresponding first pair cavity to the waveguide transmission line. The first pair cavities are positioned adjacent each other along a stacking extension perpendicular to the main propagation extension such that they share a first common wall and are adapted to be positioned adjacent the waveguide transmission line. The first pair of cavities comprises a first capacitive aperture arrangement in the first common wall, mutually connecting the first pair cavities.

A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

A transition unit providing a radio frequency signal transition between a radio frequency hollow waveguide system and a planar transmission line comprises two or more transition sections of transmission line arranged adjacent to each other at a first surface of the first substrate layer of a substrate layer arrangement. The hollow waveguide system comprises a distribution section. One input waveguide is separated into one dedicated output waveguide for each of the transition sections. For each of the transition sections of the transmission lines a corresponding end section of a respective output waveguide is directed perpendicular to the first surface of the first substrate layer. For each end section an open end of the end section of the waveguide system superposes the corresponding transition section. The two or more end sections are arranged adjacent to each other in order to provide for favorable boundary conditions for electromagnetic wave propagation.