A transition unit providing a radio frequency signal transition between a radio frequency hollow waveguide system and a planar transmission line comprises two or more transition sections of transmission line arranged adjacent to each other at a first surface of the first substrate layer of a substrate layer arrangement. The hollow waveguide system comprises a distribution section. One input waveguide is separated into one dedicated output waveguide for each of the transition sections. For each of the transition sections of the transmission lines a corresponding end section of a respective output waveguide is directed perpendicular to the first surface of the first substrate layer. For each end section an open end of the end section of the waveguide system superposes the corresponding transition section. The two or more end sections are arranged adjacent to each other in order to provide for favorable boundary conditions for electromagnetic wave propagation.

A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. A substrate layer arrangement with a planar differential pair transmission line is arranged on one or more surfaces of at least one substrate layer. An end section of the transmission line is configured as a radio frequency signal emission pattern. The transition unit has an end section of a waveguide for electromagnetic waves that is attached to the substrate layer arrangement and superposes the radio frequency signal emission pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the waveguide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. Opposite to the end section a back cavity is attached with an open end towards the substrate layer arrangement.

A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. A substrate layer arrangement with a planar differential pair transmission line is arranged on one or more surfaces of at least one substrate layer. An end section of the transmission line is configured as a radio frequency signal emission pattern. The transition unit has an end section of a waveguide for electromagnetic waves that is attached to the substrate layer arrangement and superposes the radio frequency signal emission pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the waveguide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. Opposite to the end section a back cavity is attached with an open end towards the substrate layer arrangement.

A microwave system includes a molding compound layer having opposing first and second surfaces, an integrated circuit device at least partially surrounded by said molding compound layer to define a fan-out area located laterally outside the integrated circuit device's outline, a plurality of through-mold vias within said fan-out area extending through said molding compound layer between said first and second surfaces, a re-distribution layer stack extending parallel to said second surface and comprising conducting signal paths, and a substrate comprising a first surface extending parallel to the molding compound layer. The re-distribution layer stack is positioned on top of an array of solder balls carried by the substrate. The system also includes two coupling slots arranged on different levels to resonantly couple with each other, and at least one hollow waveguide with an open (coupling) aperture at one end in direct proximity of one of said two coupling slots.

A microwave system includes a molding compound layer having opposing first and second surfaces, an integrated circuit device at least partially surrounded by said molding compound layer to define a fan-out area located laterally outside the integrated circuit device's outline, a plurality of through-mold vias within said fan-out area extending through said molding compound layer between said first and second surfaces, a re-distribution layer stack extending parallel to said second surface and comprising conducting signal paths, and a substrate comprising a first surface extending parallel to the molding compound layer. The re-distribution layer stack is positioned on top of an array of solder balls carried by the substrate. The system also includes two coupling slots arranged on different levels to resonantly couple with each other, and at least one hollow waveguide with an open (coupling) aperture at one end in direct proximity of one of said two coupling slots.

An apparatus, including a waveguide, a first circuit, a second circuit. The waveguide is connected to the first circuit and the second circuit. The first circuit is located within a cryostat.

In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.

In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.

A transceiver includes first electrical channels and second electrical channels. The first electrical channels are configured to transfer electromagnetic signals to first air waveguides. Each of the first electrical channels extend from a transmitter along an exterior surface of a chip package that supports the transmitter and terminate at first transitions on the exterior surface. Each of the first plurality of air waveguides are attached to the exterior surface and overlay one of the first transitions. The transceiver also includes second electrical channels configured to transfer second electromagnetic signals from second air waveguides. Each of the second electrical channels extend from a receiver along the exterior surface of the chip package that supports the receiver and terminate at second transitions on the exterior surface. Each of the second air waveguides are attached to the exterior surface and overlay one of the second transitions.

An efficient, low-profile, lightweight fixed-beam (constant angle of departure) aperture antenna. The aperture antenna includes an array of horn radiators coupled to a waveguide diplexer by means of a stripline distribution network. The stripline distribution network is embedded in a printed wiring board (PWB), which PWB is sandwiched between a radiator plate (incorporating the horn radiators) and a diplexer plate. The aperture antenna may further include a backside ground plane made of metal. The diplexer plate and backside cover plate are configured to form the waveguide diplexer. Each horn radiator has a respective circular opening at one end adjacent to the PWB. The diplexer plate includes an array of circular waveguide backshorts which are congruent and respectively aligned with the circular openings of the horn radiators. The radiator plate further includes a rectangular waveguide backshort which is congruent and aligned with a rectangular port of the diplexer plate.