Disclosed is an exemplary guided surface waveguide probe. In one embodiment, the guided surface waveguide probe comprises a charge terminal elevated to a height above the lossy conducting medium; a support structure that supports the charge terminal; an internal coil that is supported within the support structure and is coupled to an excitation source; a conductive tube having a first end conductively coupled to the at least one section of internal coil, wherein a second end of the conductive tube extends vertically towards and is electrically coupled to the charge terminal; at least one sensor electrically coupled to the charge terminal or the internal coil, wherein the at least one sensor measures an operational parameter of the guided surface waveguide probe; and a non-conductive channel connected to the at least one sensor by which data associated with the operational parameter is communicated.

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

A composite electronic component includes a multilayer stack, a filter, and an antenna. The filter is located within the multilayer stack and interposed between a first ground conductor layer and a second ground conductor layer. The antenna includes a radiation element. The radiation element is located on a side of the second ground conductor layer opposite from the first ground conductor layer. When viewed in a direction parallel to the stacking direction of the multilayer stack, the radiation element entirely lies inside the perimeter of the second ground conductor layer. The multilayer stack includes a plurality of connection conductor sections arranged around the filter and connecting the first ground conductor layer and the second ground conductor layer.

A composite electronic component includes a multilayer stack, a filter, and an antenna. The filter is located within the multilayer stack and interposed between a first ground conductor layer and a second ground conductor layer. The antenna includes a radiation element. The radiation element is located on a side of the second ground conductor layer opposite from the first ground conductor layer. When viewed in a direction parallel to the stacking direction of the multilayer stack, the radiation element entirely lies inside the perimeter of the second ground conductor layer. The multilayer stack includes a plurality of connection conductor sections arranged around the filter and connecting the first ground conductor layer and the second ground conductor layer.

A directional coupler includes: a first waffle-iron ridge waveguide extending from one end to other end; a second waffle-iron ridge waveguide extending from one end to the other end; a first bypass waveguide connecting a first site of the first waffle-iron ridge waveguide and a first site of the second waffle-iron ridge waveguide; and a second bypass waveguide connecting a second site of the first waffle-iron ridge waveguide and a second site of the second waffle-iron ridge waveguide.

A directional coupler includes: a first waffle-iron ridge waveguide extending from one end to other end; a second waffle-iron ridge waveguide extending from one end to the other end; a first bypass waveguide connecting a first site of the first waffle-iron ridge waveguide and a first site of the second waffle-iron ridge waveguide; and a second bypass waveguide connecting a second site of the first waffle-iron ridge waveguide and a second site of the second waffle-iron ridge waveguide.

A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.