Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.

According to the present invention, provided is an antenna mechanism 3 that adjusts the impedance of an antenna body through which a high-frequency current flows to generate plasma by means of a simple configuration, and generates plasma P, and comprises: the antenna body 31 through which high-frequency current flows; and one or a plurality of adjustment circuits 32 provided adjacent to the antenna body 31. The adjustment circuit 32 has a metal conductor 321 forming a closed circuit and a capacitor 322 forming the closed circuit.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.