Embodiments of the present disclosure relate to a coupling component, a microwave device and an electronic device. The coupling component includes a first ground electrode, a first dielectric layer, a first transmission line, a second dielectric layer, a second ground electrode, a first substrate, a second transmission line, a second substrate and a third ground electrode which are sequentially stacked. Each of the first to third electrodes has a slot, and orthographic projections of the slots on the first dielectric layer overlap. An orthographic projection of a coupling end of the first transmission line on the first dielectric layer overlaps an orthographic projection of the slot of the second ground electrode on the first dielectric layer. An orthographic projection of a coupling end of the second transmission line on the first dielectric layer overlaps the orthographic projection of the slot of the second ground electrode.

The antenna module includes a first substrate and a second substrate on each of which a radiating element is arranged, a third substrate, and a switch circuit. An RFIC for supplying a radio frequency signal to the first substrate and the second substrate is arranged on the third substrate. The switch circuit is configured to change over a connection between the RFIC and the radiating element on the first substrate and a connection between the RFIC and the radiating element on the second substrate.

A high frequency circuit module mounted on a first board that is a printed circuit board, includes: a second board; a high frequency circuit disposed on a first surface of the second board; a high frequency signal line disposed on the first surface of the second board, and extending from the high frequency circuit; and a matching member disposed on the first surface so as to cover at least a part of the high frequency signal line, and configured to adjust an impedance in the high frequency signal line. The matching member includes: a reference potential conductor separated from the high frequency signal line in a direction from a second surface, of the second board, opposite to the first surface, toward the first surface, the reference potential conductor being set at a reference potential; and a dielectric disposed between the reference potential conductor and the high frequency signal line.

The present invention relates to the field of communications technologies and discloses a phase shifter and a feed network. The phase shifter includes at least one phase shift component. The phase shift component includes a substrate, a microstrip coupling structure disposed on a first plane of the substrate, a microstrip transmission line connected to and coplanar with the microstrip coupling structure, and a microstrip/coplanar-waveguide coupling structure, where the microstrip/coplanar-waveguide coupling structure includes a microstrip connected to and coplanar with the microstrip transmission line, and a coplanar waveguide disposed opposite to the microstrip on the substrate and coupled with the microstrip. A phase shifter using a microstrip/coplanar-waveguide coupling structure has a small volume and costs low, thereby facilitating feed network design.

The present invention relates to the field of communications technologies and discloses a phase shifter and a feed network. The phase shifter includes at least one phase shift component. The phase shift component includes a substrate, a microstrip coupling structure disposed on a first plane of the substrate, a microstrip transmission line connected to and coplanar with the microstrip coupling structure, and a microstrip/coplanar-waveguide coupling structure, where the microstrip/coplanar-waveguide coupling structure includes a microstrip connected to and coplanar with the microstrip transmission line, and a coplanar waveguide disposed opposite to the microstrip on the substrate and coupled with the microstrip. A phase shifter using a microstrip/coplanar-waveguide coupling structure has a small volume and costs low, thereby facilitating feed network design.

The present disclosure relates to coupled slow-wave transmission lines. In this regard, a transmission line structure is provided. The transmission line structure includes a first undulating signal path formed from first loop structures. The transmission line structure also includes a second undulating signal path formed from second loop structures. The second undulating signal path is disposed alongside of the first undulating signal path. Further, a first ground structure is disposed above or below either one or both of the first undulating signal path and the second undulating signal path.

The present disclosure relates to a tunable slow-wave transmission line. The tunable slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. The tunable slow-wave transmission line includes a first ground structure disposed along the undulating signal path. Further, the tunable slow-wave transmission line includes one or more circuits that may alter a signal transmitted in the tunable slow-wave transmission line so as to tune a frequency of the signal.

The present disclosure relates to a slow-wave transmission line for transmitting slow-wave signals with reduced loss. In this regard, the slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. Additionally, the slow-wave transmission line includes a first ground structure disposed along the undulating signal path. In this manner, a loop inductance is formed by each of the at least two loop structures, while a first distributed capacitance is formed between the undulating signal path and the ground structure.

A semiconductor device includes a base, a matching circuit including a substrate, a ground layer, and a signal line, wherein a width of the signal line on a first end side of the substrate is smaller than a width of the substrate and larger than that of the signal line on a second end side, and a distance between the ground layer and the signal line on the first end side is larger than a distance therebetween on the second end side, a semiconductor element electrically connected to the signal line on the first end side of the matching circuit by first bonding wires, a frame body, a feedthrough having a lead, and second bonding wires electrically connected to the lead and the signal line on the second end side, wherein the first bonding wires are arranged in parallel, and the second bonding wires are arranged in parallel.

Aspects of the present disclosure involve a system and method for generating noise waves at millimeter wave frequencies. A noise source generator is designed to be connected to a crystalline structure for efficient heat transfer and compatibility with millimeter wave receivers. The use of crystalline structure coupled to the noise source generator allows heat from a biasing device, such as a diode, to be carried away such that the diode is able to generate noise waves while being reversed biased without compromising the device. In another embodiment, the noise source generator includes the use of a backshort transmission line with vias that is connected to the biasing device for heat transfer from the biasing device to the backshort.