H01P5/02

Antennas-in-package verification board

An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

Antennas-in-package verification board

An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

RF waveguide housing including a metal-diamond composite-base having a waveguide opening formed therein covered by a slab

A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

SOLID-STATE HYPERFREQUENCY AMPLIFIER AND POWER COMBINER COMPRISING FOUR SUCH SOLID-STATE AMPLIFIERS
20230188107 · 2023-06-15 ·

A solidstate amplifier includes at least one interconnection, between a microstrip and a linearized impedance matching waveguide ridge, the interconnection being provided with a clamping device.

Radio frequency connection arrangement

A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.

Transmission line structure for transmitting radio signals
09837696 · 2017-12-05 · ·

A transmission line structure for transmitting radio signals includes a first transmission line, a first ground region, and a second transmission line. The first transmission line is arranged on a first layer of a circuit board. The first transmission line includes a first signal line and a second signal line. The first ground region is arranged between the first and second signal lines. The first and second signal lines do not contact the first ground region. The second transmission line is arranged on a second layer of the circuit board, and the second layer is different from the first layer. The second transmission line does not contact the first transmission line, and the second transmission line interleaves with the first signal line, the second signal line and the first ground area.

Radar assembly with rectangular waveguide to substrate integrated waveguide transition

A radar assembly includes a rectangular-waveguide (RWG) and a printed-circuit-board. The rectangular-waveguide (RWG) propagates electromagnetic energy in a transverse electric mode (TE10) and in a first direction. The printed-circuit-board includes a plurality of conductor-layers oriented parallel to each other. The printed-circuit-board defines a substrate-integrated-waveguide (SIW) that propagates the electromagnetic energy in a transverse electric mode (TE10) and in a second direction perpendicular to the first direction, and defines a transition that propagates the electromagnetic energy between the rectangular-wave-guide and the substrate-integrated-waveguide. The transition includes apertures defined by at least three of the plurality of conductor-layers.

HIGH POWER ION BEAM GENERATOR SYSTEMS AND METHODS

Provided herein are high energy ion beam generator systems and methods that provide low cost, high performance, robust, consistent, uniform, low gas consumption and high current/high-moderate voltage generation of neutrons and protons. Such systems and methods find use for the commercial-scale generation of neutrons and protons for a wide variety of research, medical, security, and industrial processes.

SKEW-RESISTANT MULTI-WIRE CHANNEL
20170317449 · 2017-11-02 ·

Methods and systems described include a first dielectric material having a plurality of embedded conductors of a multi-wire channel, the plurality of embedded conductors comprising at least a first, second and third conductor, wherein a first distance between the first and second conductors is less than a second distance between the first and third conductors, wherein the first dielectric material has a first dielectric constant ∈.sub.1 and a second dielectric material embedded in the first dielectric material, the second dielectric material embedded in between the first and third conductors, the second dielectric material having a second dielectric constant ∈.sub.2, wherein ∈.sub.2>∈.sub.1.

WAVEGUIDE COUPLING

The present invention is aimed at providing a waveguide coupling that enables two waveguides to be easily connected together while aligning cross sections of the two waveguides to hold central axes of the two waveguides concentrically with high accuracy. A coupling is for use in connecting two waveguides in an axial direction. The coupling includes a continuous body and a ring member. The continuous body is used to surround in a circumferential direction a connecting portion connecting the two waveguides. The continuous body includes seven partitioning bodies hinged at six portions by gudgeons to become continuous, and the partitioning bodies of end portions are connected together with screws, whereby the continuous body is formed annularly. The ring member has an annular shape, is disposed along a circumference of the waveguide, and is connected to the continuous body by screws.