A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

A waveguide structure includes at least one transmission line and at least one conductive pattern layer. At least a portion of the transmission line and at least a portion of the conductive pattern layer overlap each other as observed from a surface side of the conductive pattern layer. A surface electrical resistance value of the conductive pattern layer is in a range of 0.005 Ω/□ to 30 Ω/□.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

The invention relates to a method for making a dielectric reflectarray antenna, and a dielectric reflectarray antenna made using such method. The method includes removing, from a substrate having a dielectric layer and a first outer metallic layer arranged on one side of the dielectric layer, the first outer metallic layer to form an intermediate substrate. The method also includes cutting the intermediate substrate to integrally form a dielectric reflectarray with an array of dielectric reflector elements of the dielectric reflectarray antenna.

Various aspects directed towards an integrated transverse electromagnetic (TEM) transmission line structure for probe calibration are disclosed. In one example, the integrated TEM transmission line structure includes a printed circuit board (PCB) and an air-dielectric coplanar waveguide (CPW). For this example, the air-dielectric CPW includes an air trace in a cutout slot of the PCB. In another example, a method is disclosed, which includes forming an air-dielectric CPW on a PCB in which the air-dielectric CPW includes an air trace in a cutout slot of the PCB. In a further example, an integrated TEM transmission line structure includes an air-dielectric CPW with an air trace. For this example, a first connector is electrically coupled to a first end of the air-dielectric CPW, and a second connector is electrically coupled to a second end of the air-dielectric CPW.

The invention relates to a method of manufacturing technical radio frequency functional structures comprising the steps of providing a base body determining the shape of the functional structure and applying an electrically conductive layer to the shape-determining base body by means of wetting the base body with a dispersion containing microparticles and/or nanoparticles.

An asymmetric, broadband, compact and low-PIM orthomode transducer comprised of two parts is presented. Mating of the two parts results in the formation of a choke flange as well as a critical impedance step which suppresses unwanted modes and enables broadband matching of the junction between the two parts. Furthermore, a cruciform-quatrefoil waveguide type is utilized that transitions to an aperture. This waveguide configuration can lead to a lower overall part length, an improved reflection, and reduced manufacturing costs.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector can be attenuated or even eliminated from the frequency response. Thus, the method improves the insertion loss of the transition at high frequencies, and increases its 1-dB passband. Note that the signal line of the microstrip line is not inserted into the through hole of the metallic ring in the final assembly of the transition.

A power combiner/divider includes a main conductor; a ground conductor radially exterior of the main conductor; an input connector having a center conductor electrically coupled to the main conductor and having a second conductor electrically coupled to the ground conductor; a conductive cylinder including an inner cylindrical surface radially exterior of and spaced apart from the main conductor, including an outer cylindrical surface; a second ground conductor radially exterior of the outer cylindrical surface of the conductive cylinder, a gap being defined between the second ground conductor and the outer surface of the conductive cylinder; a plurality of output connectors, the output connectors having center conductors electrically coupled to the conductive cylinder and having respective second conductors electrically coupled to the second ground conductor; and means for receiving and retaining a gas inside the divider/combiner. Methods of manufacturing are also disclosed.