The present application describes a method of tuning a printed device. The method includes measuring a frequency response of a target device and a device under tune (DUT). The method includes computing, based on the measured frequency response, a coupling matrix for the target device and a coupling matrix for the DUT. The method also includes extracting eigenvalues for the coupling matrix of the target device and a first set of eigenvalues for the coupling matrix of the DUT. The eigenvalues of the target device are different than the first set of eigenvalues of the DUT. The method further includes tuning the DUT with a material removal source. The method even further includes measuring a second set of eigenvalues of the DUT. The second set of eigenvalues is different from the first set of eigenvalues of the DUT. The method yet even further includes calculating a tune path for iterative convergence of the second or a subsequent set of eigenvalues of the DUT with the eigenvalues of the target device. The method still even further includes observing the iterative convergence of the DUT and the target device.

The present disclosure provides a terahertz mixer, a method of manufacturing the terahertz mixer, and an electronic device including the mixer. The terahertz mixer includes: a cavity for forming a radio frequency input waveguide and a local oscillator input waveguide, and for accommodating a microstrip line; the microstrip line formed on at least a part of an inner surface of the cavity by using a semiconductor growth process, wherein the microstrip line extends into a portion of the cavity where the radio frequency input waveguide is located so as to form a microstrip antenna for receiving a radio frequency input signal, and into a portion of the cavity where the local oscillator input waveguide is located so as to form a microstrip antenna for receiving a local oscillator input signal.

A radio frequency filter apparatus is disclosed, including an elongate hollow body portion having an inner side and an outer side. The apparatus further includes an iris structure on the inner side of the body portion and a stiffening structure on the outer side of the body portion. The stiffening structure is aligned with the iris structure.

A multiple-layer circuit board has a signaling layer plane, an exterior layer plane, and a ground layer plane. A pair of differential signal lines implemented as strip-lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. A dual slot common mode noise filter may be etched within the ground layer and may include a first U-shaped etching pair comprising a first U-shaped etching and a second U-shaped etching opposing the first U-shaped etching within the ground layer plane.

A laminated circuit assembly for filtering signals in one or more signal lines in, for instance, a quantum computing system is provided. In one example, the laminated circuit assembly includes one or more signal lines disposed within a substrate in a first direction. The laminated circuit assembly includes a dielectric portion of the substrate. The laminated circuit assembly includes a filter portion of the substrate extending in a first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency. The filter portion is configured to attenuate infrared signals passing through the one or more signal lines.

There is provided a substrate integrated waveguide filter having a central region and a peripheral region surrounding the central region, and including: a first substrate; a second substrate opposite to the first substrate; a plurality of conductive support pillars between the first substrate and the second substrate, within the peripheral region, and surrounding the central region, wherein a distance between at least one pair of adjacent two of the plurality of conductive support pillars is less than a wavelength of an electromagnetic wave to be transmitted by the substrate integrated waveguide filter; and a dielectric layer between the first substrate and the second substrate, wherein a permittivity of the dielectric layer is configured to be changed as a strength of an electric field formed between the first substrate and the second substrate is changed to adjust a frequency of the substrate integrated waveguide

The present disclosure relates to a coupling structure of a filter. One example coupling structure of the filter includes at least two resonant cavities. Each resonant cavity includes an internal space surrounded by a resonant cavity wall, a resonant cavity bottom plate, and a resonant cavity lid. The at least two resonant cavities are sequentially connected. Each resonant cavity of the at least two resonant cavities includes one resonator. A coupling rib assembly is between every two resonant cavities of the at least two resonant cavities. The coupling rib assembly includes a first coupling rib and a second coupling rib, where the first coupling rib is connected to the resonant cavity wall and the resonant cavity bottom plate to block two adjacent resonant cavities from each other, and the second coupling rib is connected to the resonant cavity bottom plate and intersects with the first coupling rib.

A method of manufacturing a ceramic resonator radio frequency filter includes placing one or more first coaxial resonators on a printed circuit board, and placing one or more second coaxial resonators over the one or more first coaxial resonators so that the coaxial resonators are arranged in a stacked configuration on the printed circuit board. The method also includes electrically connecting the one or more first coaxial resonators and second coaxial resonators to the printed circuit board.

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.