A system and method for fabricating accelerator cavities comprises forming at least two half cavities and joining the half cavities with a longitudinal seal. The half cavities can comprise at least one of aluminum, copper, tin, and copper alloys. The half cavities can be coated with a superconductor or combination of materials configured to form a superconductor coating.

Methods, apparatuses, and devices for quantum chip preparation include acquiring a coplanar waveguide in a quantum chip; and establishing a connecting bridge on the coplanar waveguide using a bonding machine, wherein the connecting bridge is configured to connect a first reference ground and a second reference ground located on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency. A quantum chip includes a transmission line configured for signal transmission; and a resonant cavity coupled to the transmission line and configured to regulate an operating state of qubits on the quantum chip, wherein the transmission line and the resonant cavity are both composed of a coplanar waveguide, the coplanar waveguide is provided with a connecting bridge, and the connecting bridge is configured to connect a first reference ground and a second reference ground on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency.

A titanium (Ti) seed layer is formed from a Ti source directly on a surface of a substrate, where the surface is substantially free of oxide and nitride, and a reactive nitrogen species is introduced from a nitrogen plasma source and additional Ti is introduced from the Ti source, wherein the nitrogen plasma: (a) reacts with the Ti seed layer to form TiN and (b) reacts with the additional Ti to form additional TiN. The TiN and additional TiN collectively form a TiN superconducting layer that directly contacts the surface of the substrate.

A method for manufacturing a superconducting LC-type resonator of the type including at least one high-resistivity substrate on which are printed an inductive meander, a first so-called lower electrode and a second so-called upper electrode arranged opposite the first so as to form together a capacitor connected in parallel with the inductive meander, as well as inductive coupling means dedicated to the resonator, in which a sacrificial aluminium layer is deposited between the first and second electrodes. Also disclosed is the superconducting LC-type resonator thus obtained and the use of such a resonator for detecting the noise of a millimetre photon.

A microwave resonator device including a first resonator member comprised of a dielectric material and a second resonator member comprised of a dielectric material. The second resonator member can be positioned spatially offset from the first resonator member to define a spatial interaction region configured to confine an electromagnetic field in a microwave region of the electromagnetic spectrum. The spatial offset between the first resonator member and the second resonator member defining the spatial interaction region is less than the microwave wavelength associated with a resonant frequency of the microwave resonator device. The microwave resonator device facilitates generation of a resonant field enhancement within the spatial interaction region.

A semiconductor device has an amplifier and common mode suppression (CMS) circuit formed on a common substrate. The CMS circuit has a first input and second input coupled for receiving an input signal and further has a first output coupled to a first input of the amplifier and a second output coupled to a second input of the amplifier to reduce common mode. The CMS circuit further has a ground plane, a first conductive trace disposed over the ground plane and coupled between the first input and first output, second conductive trace disposed over the ground plane and coupled between the second input and second output, and third conductive trace disposed over the ground plane with a first end of the third conductive trace coupled to the ground plane and a second end of the third conductive trace open circuit to form a resonator.

A system and method for treating a cavity comprises preparing a superconducting radio frequency (SRF) cavity for removal of a dielectric layer from on an inner surface of the SRF cavity, subjecting the SRF cavity to a heat treatment in order to remove the dielectric layer from the inner surface of the SRF cavity, and preventing the development of a new dielectric layer on the inner surface of the SRF cavity by preventing an interaction between the inner surface of the SRF cavity and atmospheric gasses.

A technique relates to a superconducting airbridge on a structure. A first ground plane, resonator, and second ground plane are formed on a substrate. A first lift-off pattern is formed of a first lift-off resist and a first photoresist. The first photoresist is deposited on the first lift-off resist. A superconducting sacrificial layer is deposited while using the first lift-off pattern. The first lift-off pattern is removed. A cross-over lift-off pattern is formed of a second lift-off resist and a second photoresist. The second photoresist is deposited on the second lift-off resist. A cross-over superconducting material is deposited to be formed as the superconducting airbridge while using the cross-over lift-off pattern. The cross-over lift-off pattern is removed. The superconducting airbridge is formed to connect the first and second ground planes by removing the superconducting sacrificial layer underneath the cross-over superconducting material. The superconducting airbridge crosses over the resonator.

Techniques regarding quantum transducers are provided. For example, one or more embodiments described herein can include an apparatus that can include a superconducting microwave resonator having a microstrip architecture that includes a dielectric layer positioned between a superconducting waveguide and a ground plane. The apparatus can also include an optical resonator positioned within the dielectric layer.

Disclosed is a resonator for expanding a transfer distance. A conical resonator includes a metal layer configured to operate according to a resonant frequency, and a dielectric layer coupled to the top or bottom of the metal layer to space the metal layer apart from another metal layer without overlap, wherein the metal layer and the dielectric layer have a Swiss-roll structure, and include an input face to which power is supplied on the bottom and an open face on the top.