H01Q1/36

SYSTEM AND METHOD WHICH PROVIDES WIRELESS COMMUNICATION BETWEEN BIO-NANO ELEMENTS AND MACRO/MICRO DEVICES
20230027600 · 2023-01-26 · ·

A system for receiving data from the nano-elements inside the body or on the body is provided, including a molecular communication unit. The molecular communication unit includes an antenna to be attached to the body or on the body in order to transfer the data from the inside of the body to the outside of the body and an antenna body configured to change and reflect an electromagnetic signal when the antenna is subjected to electromagnetic signal, and the antenna body includes a re-shapeable part made of a material which changes in form when it is subjected to a factor inside the body. A system for sending data to nano-elements is also provided.

SYSTEM AND METHOD WHICH PROVIDES WIRELESS COMMUNICATION BETWEEN BIO-NANO ELEMENTS AND MACRO/MICRO DEVICES
20230027600 · 2023-01-26 · ·

A system for receiving data from the nano-elements inside the body or on the body is provided, including a molecular communication unit. The molecular communication unit includes an antenna to be attached to the body or on the body in order to transfer the data from the inside of the body to the outside of the body and an antenna body configured to change and reflect an electromagnetic signal when the antenna is subjected to electromagnetic signal, and the antenna body includes a re-shapeable part made of a material which changes in form when it is subjected to a factor inside the body. A system for sending data to nano-elements is also provided.

Circularly Polarized Antennas And Wearable Devices
20230231311 · 2023-07-20 ·

Provided are a circularly polarized antenna and a wearable device. The circularly polarized antenna is applicable to a wearable device, the antenna including: an annular gap structure including an annular antenna radiator, the radiator having an effective perimeter equal to a wavelength corresponding to a central operating frequency of the circularly polarized antenna; a feeding terminal connected across the gap structure, electrically connected to the radiator at one end, and connected to a feeding module of a mainboard of the wearable device at the other end; and at least one first grounding terminal connected across the gap structure, electrically connected to the radiator at one end, and electrically connected to a grounding module of the mainboard via an inductor at the other end.

Circularly Polarized Antennas And Wearable Devices
20230231311 · 2023-07-20 ·

Provided are a circularly polarized antenna and a wearable device. The circularly polarized antenna is applicable to a wearable device, the antenna including: an annular gap structure including an annular antenna radiator, the radiator having an effective perimeter equal to a wavelength corresponding to a central operating frequency of the circularly polarized antenna; a feeding terminal connected across the gap structure, electrically connected to the radiator at one end, and connected to a feeding module of a mainboard of the wearable device at the other end; and at least one first grounding terminal connected across the gap structure, electrically connected to the radiator at one end, and electrically connected to a grounding module of the mainboard via an inductor at the other end.

Semiconductor packages with antennas

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

SENSORS WITH DEFORMABLE CONDUCTORS AND SELECTIVE DEFORMATION
20230228634 · 2023-07-20 · ·

A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

SENSORS WITH DEFORMABLE CONDUCTORS AND SELECTIVE DEFORMATION
20230228634 · 2023-07-20 · ·

A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

FILAR ANTENNA ELEMENT DEVICES AND METHODS
20230231313 · 2023-07-20 ·

Single band and multiband wireless antennas are an important element of wireless systems. Competing tradeoffs of overall footprint, performance aspects such as impedance matching and cost require not only consideration but become significant when multiple antenna elements are employed within a single antenna such as to obtain circular polarization transmit and/or receive. Accordingly, it would be beneficial to provide designers of a wide range of electrical devices and systems with compact single or multiple frequency band antennas which, in addition to providing the controlled radiation pattern and circular polarization purity (where required) are impedance matched without substantially increasing the footprint of the antenna and/or the complexity of the microwave/RF circuit interfaced to them, whilst supporting multiple signals to/from multiple antenna elements in antennas employing them. Solutions present achieve this through provisioning one or more capacitive series reactances discretely or in combination with one or more shunt capacitive reactances.

Antenna module and method for manufacturing the same

An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.

Antenna module and method for manufacturing the same

An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.