A wireless wearable device comprises a radiating system that contains at least a non-resonant element disposed in different arrangements within a radiating structure in the radiating system, featuring compact dimensions and an adequate performance when operating on a carrier living body.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

A system for transmitting and receiving wireless signals through a physical barrier, such as walls or windows, to wireless computing devices that are located internal to a structure that is formed in part by the physical barrier. The wireless signals are millimeter waveforms with gigahertz frequencies that are communicated with 5G communication protocols by one or more remote base station nodes located external to the physical barrier. One or more external antennas are configured to communicate RF wireless signals with HMA waveforms to remote wireless base station. In one or more embodiments, the RF wireless signals are amplified and communicated bi-statically through the window barrier between customer premises equipment and an authorized remote wireless base station.

An antenna comprises an axial helical radiating element and a corrugated ground plane. The axial helical radiating element provides a radiation pattern substantially parallel to a primary axis of rotation of the helical radiating element. The corrugated ground plane, disposed proximate to a back region of the antenna, comprises corrugations to increase an electrical length of travel for radial standing waves between an axial helical input, at which the axial helical radiating element is coupled to the corrugated ground plane, to an outer edge of the corrugated ground plane.

An electronic modulating device is provided. The electronic modulating device includes a substrate, a plurality of first modulating electrodes disposed on the substrate, and a plurality of second modulating electrodes disposed on the substrate. The area of one of the first modulating electrodes is greater than the area of one of the second modulating electrodes. The ratio of the number of first modulating electrodes to the number of second modulating electrodes is in a range from 0.5 to 2.0.

An electronic modulating device is provided. The electronic modulating device includes a substrate, a plurality of first modulating electrodes disposed on the substrate, and a plurality of second modulating electrodes disposed on the substrate. The area of one of the first modulating electrodes is greater than the area of one of the second modulating electrodes. The ratio of the number of first modulating electrodes to the number of second modulating electrodes is in a range from 0.5 to 2.0.

A semiconductor device having an integrated antenna is provided. The semiconductor device includes a base die having an integrated circuit formed at an active surface and a cap die bonded to the backside surface of the base die. A metal trace is formed over a top surface of the cap die. A cavity is formed under the metal trace. A conductive via is formed through the base die and the cap die interconnecting the metal trace and a conductive trace of the integrated circuit.

A radiating element comprises a first radiator having first and second dipole arms that each include a narrowed arm segment and a widened arm segment and a second radiator having third and fourth dipole arms that each include a narrowed arm segment and a widened arm segment, a first feed line configured to feed a first polarized RF signal to the first through fourth dipole arms, and a second feed line configured to feed a second polarized RF signal to the first through fourth dipole arms.

A radiating element comprises a first radiator having first and second dipole arms that each include a narrowed arm segment and a widened arm segment and a second radiator having third and fourth dipole arms that each include a narrowed arm segment and a widened arm segment, a first feed line configured to feed a first polarized RF signal to the first through fourth dipole arms, and a second feed line configured to feed a second polarized RF signal to the first through fourth dipole arms.