H01Q1/40

Sensor module

A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.

AXIAL MODE HELICAL ANTENNA WITH IMPROVED/SIMPLIFIED PARALLEL OPEN WIRE IMPEDANCE MATCHING TECHNIQUE
20220352624 · 2022-11-03 · ·

A low-profile axial mode helical type antenna that employs hollow copper tubing for the radiating element, a singular semi hollow dielectric support structure, low pitch angle and an improved/simplified parallel open wire impedance matching technique. This antenna has a wide radiating pattern as well as high forward gain and circular polarization. It is designed to work in the field of live entertainment including reception and transmission of wireless microphones, in-ear monitors, communications and cue control systems. It operates from 470-663 MHz.

AXIAL MODE HELICAL ANTENNA WITH IMPROVED/SIMPLIFIED PARALLEL OPEN WIRE IMPEDANCE MATCHING TECHNIQUE
20220352624 · 2022-11-03 · ·

A low-profile axial mode helical type antenna that employs hollow copper tubing for the radiating element, a singular semi hollow dielectric support structure, low pitch angle and an improved/simplified parallel open wire impedance matching technique. This antenna has a wide radiating pattern as well as high forward gain and circular polarization. It is designed to work in the field of live entertainment including reception and transmission of wireless microphones, in-ear monitors, communications and cue control systems. It operates from 470-663 MHz.

MULTILAYER SUBSTRATE MODULE
20230036907 · 2023-02-02 ·

A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

ANTENNA DEVICE AND METHOD FOR MANUFACTURING THE SAME

An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.

Patch antenna for equipping a spacecraft
11489248 · 2022-11-01 · ·

A patch antenna intended to equip a spacecraft, the antenna comprising a dielectric substrate, a radiating antenna element present on the dielectric substrate, the radiating antenna element having a center of symmetry and an area devoid of material, the center of symmetry being present in the area devoid of material, and a protective layer covering the radiating antenna element.

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

Radiator having a ridged feed structure

Methods and apparatus for a radiator assembly having a feed circuit with an air interface to a quadridge feed structure to excite an antenna, such as a stacked patch antenna. Embodiments of the assembly can provide enhanced bandwidth, scan angle performance, and coincident phase centers for dual-linear polarizations.

ANTENNA MODULE AND SEMICONDUCTOR DEVICE PACKAGE

The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.