An antenna and radiation unit thereof, and balun structure of radiation unit are disclosed. The radiation unit has two dipoles belonging to a same polarization and two feeding components respectively feeding the two dipoles. One end of each of the two feeding components is electrically connected to its corresponding dipole, and the other end of each of the two feeding components is combined through a same physical combining port inherent in the radiation unit. By arranging a combining port inherent to the radiation unit and connecting it to a respective end of two feeding components connected to two dipoles of the same polarization, the signals of the two dipoles are divided/combined through the combining port.

An antenna and radiation unit thereof, and balun structure of radiation unit are disclosed. The radiation unit has two dipoles belonging to a same polarization and two feeding components respectively feeding the two dipoles. One end of each of the two feeding components is electrically connected to its corresponding dipole, and the other end of each of the two feeding components is combined through a same physical combining port inherent in the radiation unit. By arranging a combining port inherent to the radiation unit and connecting it to a respective end of two feeding components connected to two dipoles of the same polarization, the signals of the two dipoles are divided/combined through the combining port.

Multiple circuits in a computing device can share one or more conductive elements. The use of the conductive element can vary by circuit, such as an antenna radiator for a radio frequency (RF) circuit or an electrode for an electrocardiography (ECG) circuit. The circuitry sharing a conductive element can utilize signals obtained over different frequency ranges. Those ranges can be used to select decoupling circuitry, or elements, that can enable the respective circuits to obtain signals over a respective frequency range, excluding signals over one or more other frequency ranges corresponding to other circuitry sharing the circuit. Such an approach allows for concurrent independent operation of the circuitry sharing a conductive element.

Multiple circuits in a computing device can share one or more conductive elements. The use of the conductive element can vary by circuit, such as an antenna radiator for a radio frequency (RF) circuit or an electrode for an electrocardiography (ECG) circuit. The circuitry sharing a conductive element can utilize signals obtained over different frequency ranges. Those ranges can be used to select decoupling circuitry, or elements, that can enable the respective circuits to obtain signals over a respective frequency range, excluding signals over one or more other frequency ranges corresponding to other circuitry sharing the circuit. Such an approach allows for concurrent independent operation of the circuitry sharing a conductive element.

An antenna includes a piezoelectric disc. The antenna further includes a first electrode disposed on a first surface of the piezoelectric disc and a second electrode disposed on a second surface of the piezoelectric disc that is opposite to the first surface. The first electrode and the second electrode are to receive a time-varying voltage to excite a mechanical vibration in the piezoelectric disc, and the piezoelectric disc is to radiate electromagnetic energy at a particular frequency responsive to the mechanical vibration.

An antenna includes a piezoelectric disc. The antenna further includes a first electrode disposed on a first surface of the piezoelectric disc and a second electrode disposed on a second surface of the piezoelectric disc that is opposite to the first surface. The first electrode and the second electrode are to receive a time-varying voltage to excite a mechanical vibration in the piezoelectric disc, and the piezoelectric disc is to radiate electromagnetic energy at a particular frequency responsive to the mechanical vibration.

Antenna systems for access points and other wireless radio units include an RF ground plane, a radiating element mounted in front of the RF ground plane, and a coaxial feed cable coupled to the radiating element. The cable jacket includes a first opening that exposes a first portion of an outer conductor of the coaxial feed cable so that the cable jacket is on either side of the first opening along a longitudinal direction of the coaxial feed cable. The first portion of the outer conductor is galvanically connected to the RF ground plane via a first direct galvanic connection.

Antenna systems for access points and other wireless radio units include an RF ground plane, a radiating element mounted in front of the RF ground plane, and a coaxial feed cable coupled to the radiating element. The cable jacket includes a first opening that exposes a first portion of an outer conductor of the coaxial feed cable so that the cable jacket is on either side of the first opening along a longitudinal direction of the coaxial feed cable. The first portion of the outer conductor is galvanically connected to the RF ground plane via a first direct galvanic connection.

A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.