A phase shifter includes a first substrate; a microstrip formed on the first substrate so as to extend in a first direction; a ground layer disposed with a space on the upper surface of the microstrip and having a defected ground structure (DGS) with a defected pattern formed therein; a second substrate disposed on the ground layer; and a liquid crystal layer disposed in a space between the first substrate and the second substrate, wherein DC voltage is applied between the ground layer and the microstrip.

A phase shifter includes a first substrate; a microstrip formed on the first substrate so as to extend in a first direction; a ground layer disposed with a space on the upper surface of the microstrip and having a defected ground structure (DGS) with a defected pattern formed therein; a second substrate disposed on the ground layer; and a liquid crystal layer disposed in a space between the first substrate and the second substrate, wherein DC voltage is applied between the ground layer and the microstrip.

This application provides a wearable device. The wearable device includes a cover, a screen component, an antenna bracket, a first antenna, a metal middle frame, a circuit board, and a bottom cover. The cover and the bottom cover are respectively connected to two sides of the metal middle frame, the screen component is connected to a side of the cover facing the bottom cover, and the circuit board is located in a space enclosed by the metal middle frame, the screen component, and the bottom cover. An accommodating space is jointly enclosed by an end of the screen component, an inner wall of the metal middle frame, and an inner wall of the cover, the antenna bracket is disposed in the accommodating space, and the first antenna is disposed on the antenna bracket and is connected to the circuit board by using a feedpoint.

This application provides a wearable device. The wearable device includes a cover, a screen component, an antenna bracket, a first antenna, a metal middle frame, a circuit board, and a bottom cover. The cover and the bottom cover are respectively connected to two sides of the metal middle frame, the screen component is connected to a side of the cover facing the bottom cover, and the circuit board is located in a space enclosed by the metal middle frame, the screen component, and the bottom cover. An accommodating space is jointly enclosed by an end of the screen component, an inner wall of the metal middle frame, and an inner wall of the cover, the antenna bracket is disposed in the accommodating space, and the first antenna is disposed on the antenna bracket and is connected to the circuit board by using a feedpoint.

An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.

An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.

An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

The present disclosure provides a dual-mode orbital angular momentum (OAM) convergence base cell array and metasurface preparation method. The base cell array includes 2.sup.n(2.sup.n-1) anisotropic cell structures and 2.sup.n isotropic cell structures. Each of the anisotropic cell structures includes a bottom ground layer, a dielectric substrate layer and a top pattern layer which are disposed in sequence from bottom to top, where each top pattern layer has an axisymmetric H-shaped structure. Each of the isotropic cell structures includes a bottom ground layer, a dielectric substrate layer and a top pattern layer which are disposed in sequence from bottom to top, where each top pattern layer has a square structure.

The present disclosure provides a dual-mode orbital angular momentum (OAM) convergence base cell array and metasurface preparation method. The base cell array includes 2.sup.n(2.sup.n-1) anisotropic cell structures and 2.sup.n isotropic cell structures. Each of the anisotropic cell structures includes a bottom ground layer, a dielectric substrate layer and a top pattern layer which are disposed in sequence from bottom to top, where each top pattern layer has an axisymmetric H-shaped structure. Each of the isotropic cell structures includes a bottom ground layer, a dielectric substrate layer and a top pattern layer which are disposed in sequence from bottom to top, where each top pattern layer has a square structure.

An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.