An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.

RF signal transmission devices for a base station antenna include a printed circuit board which has a dielectric layer, a metal pattern layer on a first main surface of the dielectric layer, and a ground layer on a second main surface of the dielectric layer. The metal pattern layer has a transmission line deformation section for enhancing the ability to withstand surge current, and the ground layer comprises a groove that is configured to at least partially compensate for the change in the characteristic impedance due to the transmission line deformation section. The RF signal transmission device can achieve good characteristic impedance matching whilst enhancing the capacity to withstand surge current. In addition, the RF signal transmission device can improve PIM performance. The present disclosure also includes a phase shifter for a base station antenna and a base station antenna.

RF signal transmission devices for a base station antenna include a printed circuit board which has a dielectric layer, a metal pattern layer on a first main surface of the dielectric layer, and a ground layer on a second main surface of the dielectric layer. The metal pattern layer has a transmission line deformation section for enhancing the ability to withstand surge current, and the ground layer comprises a groove that is configured to at least partially compensate for the change in the characteristic impedance due to the transmission line deformation section. The RF signal transmission device can achieve good characteristic impedance matching whilst enhancing the capacity to withstand surge current. In addition, the RF signal transmission device can improve PIM performance. The present disclosure also includes a phase shifter for a base station antenna and a base station antenna.

Methods and devices to address antenna termination in absence of power supplies within an electronic circuit including a termination circuit and a switching circuit. The devices include regular NMOS devices that decouple the antenna from the switching circuit in absence of power supplies while the antenna is coupled to a terminating impedance having a desired impedance value through a native NMOS device. The antenna is coupled with the switching circuit via the regular NMOS device during powered conditions while the antenna is decoupled from the terminating impedance.

Methods and devices to address antenna termination in absence of power supplies within an electronic circuit including a termination circuit and a switching circuit. The devices include regular NMOS devices that decouple the antenna from the switching circuit in absence of power supplies while the antenna is coupled to a terminating impedance having a desired impedance value through a native NMOS device. The antenna is coupled with the switching circuit via the regular NMOS device during powered conditions while the antenna is decoupled from the terminating impedance.

A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.

An antenna device includes a differential antenna and a first balun. The differential antenna includes a first radiator, a first antenna port and a second antenna port connected to a first surface of the first radiator. Orthographic projections of the first antenna port and the second antenna port projected to the first radiator are symmetrical to a midpoint of the first radiator. The first balun is located on one side of the first surface of the first radiator, and its orthographic projection on the first plane where the first surface is located overlaps the first surface. The first balun includes a first port, a first wiring, a first coupling structure electrically connected to the first antenna port, and a second coupling structure electrically connected to the second antenna port. Neither the first coupling structure nor the second coupling structure directly contacts the first wiring.

An antenna device includes a differential antenna and a first balun. The differential antenna includes a first radiator, a first antenna port and a second antenna port connected to a first surface of the first radiator. Orthographic projections of the first antenna port and the second antenna port projected to the first radiator are symmetrical to a midpoint of the first radiator. The first balun is located on one side of the first surface of the first radiator, and its orthographic projection on the first plane where the first surface is located overlaps the first surface. The first balun includes a first port, a first wiring, a first coupling structure electrically connected to the first antenna port, and a second coupling structure electrically connected to the second antenna port. Neither the first coupling structure nor the second coupling structure directly contacts the first wiring.

A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.

A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.