An electronic device includes a casing, a circuit board and at least one antenna module. The casing has an accommodating space and an inner side wall surrounding the accommodating space. The circuit board is disposed in the accommodating space. Each of the antenna modules includes a first radiator and a second radiator. The first radiator is disposed on the circuit board and adjacent to the inner side wall, and includes a first section, a second section and a third section extending from the first section in opposite directions respectively. The first section includes a feeding end, and the third section includes a grounding end. The second radiator is disposed on the inner side wall. A coupling gap is formed between the first radiator and the second radiator.

An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

A mobile communication device and an antenna thereof are provided. The antenna includes a microphone and an antenna feeder, both arranged on a main board of the mobile communication device. The microphone includes a body portion, a first ground terminal and a second ground terminal. The first ground terminal surrounds a sidewall of the body portion, the first ground terminal and the second ground terminal are electrically connected, and the second ground terminal is electrically connected with the body portion. The main board is further arranged with a radio frequency module and a main board ground terminal. The radio frequency module is electrically connected with the first ground terminal through the antenna feeder, and the main board ground terminal and the second ground terminal are electrically connected.

A mobile communication device and an antenna thereof are provided. The antenna includes a microphone and an antenna feeder, both arranged on a main board of the mobile communication device. The microphone includes a body portion, a first ground terminal and a second ground terminal. The first ground terminal surrounds a sidewall of the body portion, the first ground terminal and the second ground terminal are electrically connected, and the second ground terminal is electrically connected with the body portion. The main board is further arranged with a radio frequency module and a main board ground terminal. The radio frequency module is electrically connected with the first ground terminal through the antenna feeder, and the main board ground terminal and the second ground terminal are electrically connected.

A low-profile dual-band high-isolation antenna module is fixed on a substrate and includes two high-frequency antennas and two low-frequency antennas located on two opposite sides of the substrate respectively. The bottom ends of the low-frequency antennas are connected to a grounding of the substrate. A decoupling element is disposed between the high-frequency antennas and the low-frequency antennas. The top end of each high-frequency antenna forms a bent portion, and so does the top end of each low-frequency antenna. The decoupling element has two ends extending to positions corresponding respectively to the low-frequency antennas but is not in contact with the low-frequency antennas or the high-frequency antennas. The bottom end of the decoupling element is connected to the grounding through at least one metal strip. The bent portions effectively reduce the space occupied by the antennas while the decoupling element provides isolation between the antennas.

A low-profile dual-band high-isolation antenna module is fixed on a substrate and includes two high-frequency antennas and two low-frequency antennas located on two opposite sides of the substrate respectively. The bottom ends of the low-frequency antennas are connected to a grounding of the substrate. A decoupling element is disposed between the high-frequency antennas and the low-frequency antennas. The top end of each high-frequency antenna forms a bent portion, and so does the top end of each low-frequency antenna. The decoupling element has two ends extending to positions corresponding respectively to the low-frequency antennas but is not in contact with the low-frequency antennas or the high-frequency antennas. The bottom end of the decoupling element is connected to the grounding through at least one metal strip. The bent portions effectively reduce the space occupied by the antennas while the decoupling element provides isolation between the antennas.

An antenna system includes a first antenna, a second antenna, and a third antenna. The third antenna is disposed between the first antenna and the second antenna. Both the first antenna and the second antenna operate in a first frequency band. The third antenna operates in a second frequency band which is different from the first frequency band. The first antenna, the second antenna, and the third antenna are all disposed on the same plane.

An antenna system includes a first antenna, a second antenna, and a third antenna. The third antenna is disposed between the first antenna and the second antenna. Both the first antenna and the second antenna operate in a first frequency band. The third antenna operates in a second frequency band which is different from the first frequency band. The first antenna, the second antenna, and the third antenna are all disposed on the same plane.

A filter-based color imaging array that resolves N different colors detects only 1/N.sup.th of the incoming light. In the thermal infrared wavelength range, filtering loss is exacerbated by the lower sensor detectivity at infrared wavelengths than at visible wavelengths. To avoid loss due to filtering, most spectral imagers use bulky optics, such as diffraction gratings or Fourier transform interferometers, to resolve different colors. Fortunately, it is possible to avoid filtering loss without bulky optics: detect light with interleaved arrays of sub-wavelength-spaced antennas tuned to different wavelengths. An optically sensitive element inside each antenna absorbs light at the antenna's resonant wavelength. Metallic slot antennas offer high efficiency, intrinsic unidirectionality, and lower cross-talk than dipole or bowtie antennas. Graphene serves at the optically active material inside each antenna because its 2D nature makes it easily adaptable to this imager architecture.