An on-vehicle radar device includes a mount and an antenna configured to transmit a transmission wave from an inner side of laminated glass, which includes an innermost glass layer, an outermost glass layer, and an intermediate resin layer, and receive a reflected wave. The antenna includes a transmitting antenna. When the mount is mounted on a bracket, the incident angle of the transmission wave on the innermost glass layer is greater than a Brewster angle on the inner surface of the innermost glass layer, and the incident angle of the transmission wave on the outermost glass layer is less than or equal to a Brewster angle between the outermost glass layer and the intermediate resin layer.

Embodiments relate to machines including a movable part. A transmitter circuit is configured to generate a radio signal and to transmit the radio signal towards the movable part via a transmit waveguide. A reflection of the radio signal from the movable part is received by a receive waveguide and guided through the receive waveguide to a receiver circuit, which is configured to determine a position and/or a speed of the movable part based on at least the received radio signal. The transmitter circuit and the receiver circuit may be comprised by a radar sensor.

The present disclosure provides an electronic product metal shell and a method of manufacturing the same. The electronic product metal shell includes: a metal layer; a first hard anodic oxidation layer formed on an upper surface of the metal layer; a second hard anodic oxidation layer formed on a lower surface of the metal layer; an antenna groove penetrating through the metal layer and the first hard anodic oxidation layer; and a non-conductive material filled in the antenna groove.

The present disclosure provides an electronic product metal shell and a method of manufacturing the same. The electronic product metal shell includes: a metal layer; a first hard anodic oxidation layer formed on an upper surface of the metal layer; a second hard anodic oxidation layer formed on a lower surface of the metal layer; an antenna groove penetrating through the metal layer and the first hard anodic oxidation layer; and a non-conductive material filled in the antenna groove.

An antenna cover is provided, including a first base body and at least two first fins arranged on the first base body, the first base body having a curved surface, the two first fins being arranged symmetrically to a longitudinal axis of symmetry of the antenna cover and extending substantially parallel to the longitudinal axis of symmetry, the at least two first fins having a width that tapers as a distance from the first base body increases, and the at least two first fins being arranged with a spacing that corresponds substantially to the width of the at least two fins. A method for producing a lens-shaped antenna cover is also provided.

An antenna cover is provided, including a first base body and at least two first fins arranged on the first base body, the first base body having a curved surface, the two first fins being arranged symmetrically to a longitudinal axis of symmetry of the antenna cover and extending substantially parallel to the longitudinal axis of symmetry, the at least two first fins having a width that tapers as a distance from the first base body increases, and the at least two first fins being arranged with a spacing that corresponds substantially to the width of the at least two fins. A method for producing a lens-shaped antenna cover is also provided.

The present disclosure provides a metal shell of communication equipment. The metal shell of communication equipment includes a metal substrate, a slit penetrating an inner and an outer surface of the metal substrate, a plastic-supporting layer formed on the inner surface of the metal substrate and a decorative layer formed on the outer surface of the metal substrate, wherein a width of the slit on the outer surface of the metal substrate is 15-500 μm, a width of the slit on the inner surface of the metal substrate is 20-600 μm, and a ratio of the width of the slit on the inner surface of the metal substrate to the width of the slit on the outer surface of the metal substrate is between 1.05:1 and 1.5:1.

Lower-limit frequency reflection characteristics of a horn antenna are improved even though element spacing, of less than or equal to one wavelength, is a spacing at which grating lobes do not occur in an antenna radiation pattern. The horn antenna includes a horn antenna and a conductor grid that divides an aperture A of the horn antenna in a grid pattern and that electrically connects to an inner surface of the horn antenna at the aperture A of the horn antenna. Width of the conductor grid in a direction orthogonal to a horn antenna aperture plane differs from electrical length of the path of the horn antenna of the conductor grid portion at the frequency of power supplied to the horn antenna.

Lower-limit frequency reflection characteristics of a horn antenna are improved even though element spacing, of less than or equal to one wavelength, is a spacing at which grating lobes do not occur in an antenna radiation pattern. The horn antenna includes a horn antenna and a conductor grid that divides an aperture A of the horn antenna in a grid pattern and that electrically connects to an inner surface of the horn antenna at the aperture A of the horn antenna. Width of the conductor grid in a direction orthogonal to a horn antenna aperture plane differs from electrical length of the path of the horn antenna of the conductor grid portion at the frequency of power supplied to the horn antenna.

A radar-based fill-level measuring device, comprises the following parts: a semiconductor component for producing electrical high-frequency signals or for determining the fill-level value from the received high-frequency signals; a dielectric waveguide placed in contact with the semiconductor component to couple the high-frequency signals as radar signals into an antenna and/or to couple received radar signals from the antenna as electrical signals into the semiconductor component; a potting encapsulation, which encapsulates at least the waveguide radially such that a defined cavity is formed between the waveguide and the potting encapsulation.