A method of forming a semiconductor device is provided. The method includes providing a connector structure configured for carrying a signal and providing a semiconductor die. At least a portion of the connector structure and the semiconductor die are encapsulated with an encapsulant. The semiconductor die is interconnected with the connector structure by way of a conductive trace.

According to various embodiments, an electronic device includes: a housing including a lateral member including a conductive member including an inner surface and an outer surface facing the inner surface, an antenna structure disposed in an inner space of the housing and including a substrate, and a plurality of antenna elements disposed at a first interval at the substrate, a plurality of through-holes penetrating the inner surface to at least a part of the outer surface and corresponding to the plurality of antenna elements, and a wireless communication circuit disposed in the inner space and configured to transmit or receive a radio signal in a specified frequency band through the antenna structure, wherein first opening portions of the plurality of through-holes formed in the inner surface are disposed at the first interval, and second opening portions of the plurality of through-holes formed in the outer surface are disposed at a second interval greater than the first interval.

An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas and transceiver circuitry such as millimeter wave transceiver circuitry. The antennas may be formed from metal traces on a printed circuit. The printed circuit may be a stacked printed circuit including multiple stacked substrates. Metal traces may form an array of patch antennas, Yagi antennas, and other antennas. Antenna signals associated with the antennas may pass through an inactive area in a display and through a dielectric-filled slot in a metal housing for the electronic device. Waveguide structures may be used to guide antenna signals within interior portions of the electronic device.

Embodiments relate to machines including a movable part. A transmitter circuit is configured to generate a radio signal and to transmit the radio signal towards the movable part via a transmit waveguide. A reflection of the radio signal from the movable part is received by a receive waveguide and guided through the receive waveguide to a receiver circuit, which is configured to determine a position and/or a speed of the movable part based on at least the received radio signal. The transmitter circuit and the receiver circuit may be comprised by a radar sensor.

A first module and a second module are formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate. The first module is to serialize and de-serialize a data signal. The second module is to up-convert and down-convert the data signal to and from the first module. An antenna is coupled to the second module and integrated onto the CMOS chip substrate. The antenna is coupleable to a hollow metal waveguide (HMWG). The first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna.

Lower-limit frequency reflection characteristics of a horn antenna are improved even though element spacing, of less than or equal to one wavelength, is a spacing at which grating lobes do not occur in an antenna radiation pattern. The horn antenna includes a horn antenna and a conductor grid that divides an aperture A of the horn antenna in a grid pattern and that electrically connects to an inner surface of the horn antenna at the aperture A of the horn antenna. Width of the conductor grid in a direction orthogonal to a horn antenna aperture plane differs from electrical length of the path of the horn antenna of the conductor grid portion at the frequency of power supplied to the horn antenna.

A waveguide coupling device for a radar sensor is provided. The waveguide coupling device may include a waveguide for radiating and/or receiving a radar signal and a high frequency substrate. The high frequency substrate may include at least one input waveguide for injecting at least one excitation wave into the high frequency substrate, a radiating region for coupling the excitation wave out of the high frequency substrate, and an optionally substrate-integrated waveguide coupled to the input waveguide and the radiating region. The waveguide may have an excitation end arranged on its radiation region.

A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

Presently disclosed is an antenna system having an array of ridged waveguide Vivaldi radiator (RWVR) antenna elements fed through a corporate network of suspended air striplines (SAS) with an electromagnetic bandgap (EBG) ground plane surrounding the ridged waveguide transition. The SAS transfers the electromagnetic energy to the radiating element via the ridged waveguide coupler. The Vivaldi radiator matches the output impedance of the ridged waveguide coupler/SAS to the intrinsic impedance of the surrounding medium. The EBG, which may be comprised of a photonic bandgap material or other metamaterial, allows for better frequency and bandwidth performance in a lower-profile array package, thereby reducing size and weight of the array for applications requiring small size and or low-inertia packaging. In alternate embodiments, radiating elements other than Vivaldi radiators may be used. This configuration also reduces the complexity of the manufacturing process, which in turn lowers cost.

Presently disclosed is an antenna system having an array of ridged waveguide Vivaldi radiator (RWVR) antenna elements fed through a corporate network of suspended air striplines (SAS) with an electromagnetic bandgap (EBG) ground plane surrounding the ridged waveguide transition. The SAS transfers the electromagnetic energy to the radiating element via the ridged waveguide coupler. The Vivaldi radiator matches the output impedance of the ridged waveguide coupler/SAS to the intrinsic impedance of the surrounding medium. The EBG, which may be comprised of a photonic bandgap material or other metamaterial, allows for better frequency and bandwidth performance in a lower-profile array package, thereby reducing size and weight of the array for applications requiring small size and or low-inertia packaging. In alternate embodiments, radiating elements other than Vivaldi radiators may be used. This configuration also reduces the complexity of the manufacturing process, which in turn lowers cost.