An electronic device may be provided with hybrid planar inverted-F slot antennas and indirectly fed slot antennas. A hybrid antenna may be used to form a dual band wireless local area network antenna. An indirectly fed slot antenna may be use to form a cellular telephone antenna. Antenna slots may be formed in a metal electronic device housing wall. The housing wall may have a planar rear portion and sidewall portions that extend upwards from the planar rear portion. The slots may have one or more bends. A hybrid antenna may have a slot antenna portion and a planar inverted-F antenna portion. The planar inverted-F antenna portion may have a metal resonating element patch that is supported by a support structure. The support structure may be a plastic speaker box containing a speaker driver that is not overlapped by the metal resonating element patch.

An electronic device may be provided with hybrid planar inverted-F slot antennas and indirectly fed slot antennas. A hybrid antenna may be used to form a dual band wireless local area network antenna. An indirectly fed slot antenna may be use to form a cellular telephone antenna. Antenna slots may be formed in a metal electronic device housing wall. The housing wall may have a planar rear portion and sidewall portions that extend upwards from the planar rear portion. The slots may have one or more bends. A hybrid antenna may have a slot antenna portion and a planar inverted-F antenna portion. The planar inverted-F antenna portion may have a metal resonating element patch that is supported by a support structure. The support structure may be a plastic speaker box containing a speaker driver that is not overlapped by the metal resonating element patch.

An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.

An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.

The invention relates to a patch antenna. The invention also relates to an antenna system for transmitting and receiving electromagnetic signals comprising at least one antenna according to the invention. The invention further relates to a method of manufacturing an antenna according to the invention. The invention moreover relates to a method for use in wireless communications by using an antenna according to the invention. The invention additionally relates to a RF transceiver of a wireless communications device comprising at least one antenna according to the invention. The invention further relates to an electronic device comprising an RF transceiver according to the invention.

The invention relates to a patch antenna. The invention also relates to an antenna system for transmitting and receiving electromagnetic signals comprising at least one antenna according to the invention. The invention further relates to a method of manufacturing an antenna according to the invention. The invention moreover relates to a method for use in wireless communications by using an antenna according to the invention. The invention additionally relates to a RF transceiver of a wireless communications device comprising at least one antenna according to the invention. The invention further relates to an electronic device comprising an RF transceiver according to the invention.

The present disclosure relates to an antenna assembly and an electronic device in the field of antennas. The antenna assembly includes: a first antenna, a second antenna and a metal frame. The metal frame includes: a metal plate; and a first side frame, a second side frame, a top frame and a bottom frame which enclose the metal plate. The first antenna is connected to a first radiation part of the bottom frame via a first connection point, the first radiation part being connected to the first side frame which is separated from the metal plate by a slot. The second antenna is connected to a second radiation part of the bottom frame via a second connection point, the second radiation part being disconnected from the first radiation part and the second side frame.

The present disclosure relates to an antenna assembly and an electronic device in the field of antennas. The antenna assembly includes: a first antenna, a second antenna and a metal frame. The metal frame includes: a metal plate; and a first side frame, a second side frame, a top frame and a bottom frame which enclose the metal plate. The first antenna is connected to a first radiation part of the bottom frame via a first connection point, the first radiation part being connected to the first side frame which is separated from the metal plate by a slot. The second antenna is connected to a second radiation part of the bottom frame via a second connection point, the second radiation part being disconnected from the first radiation part and the second side frame.

A system of integrated module with antenna used for an electronic device comprises a circuit board, at least one antenna exciting unit, a wireless module, a module grounding plane, a grounding metal, a camera module and a digital signal line. The antenna exciting unit is used to couple with an antenna. The wireless module and the camera module are disposed on the circuit board to couple with the module grounding plane. The wireless module is electrically connected to the antenna exciting unit. The grounding metal is electrically connected to the module grounding plane and a system grounding plane. The digital signal line is electrically connected to the wireless module and the camera module is a digital transmission media. The wireless module, the camera module and the circuit board constitute an integrated module for disposing at an up-side of a screen of the electronic device.

A system of integrated module with antenna used for an electronic device comprises a circuit board, at least one antenna exciting unit, a wireless module, a module grounding plane, a grounding metal, a camera module and a digital signal line. The antenna exciting unit is used to couple with an antenna. The wireless module and the camera module are disposed on the circuit board to couple with the module grounding plane. The wireless module is electrically connected to the antenna exciting unit. The grounding metal is electrically connected to the module grounding plane and a system grounding plane. The digital signal line is electrically connected to the wireless module and the camera module is a digital transmission media. The wireless module, the camera module and the circuit board constitute an integrated module for disposing at an up-side of a screen of the electronic device.