An antenna device which includes a plurality of antennas in a common case and is capable of achieving downsizing while suppressing a decrease of an antenna gain, is provided. An antenna device includes a TEL antenna and a capacity loaded element in a common case. The capacity loaded element is located above the TEL antenna. A length of the capacity loaded element is a positive integer multiple of one-half a wavelength of a PCS band. The TEL antenna is arranged so as to avoid a voltage maximum point of a standing wave, of the PCS band, generated in the capacity loaded element.

The antenna device includes a first antenna module and a second antenna module. The first antenna module includes a number of first antennas disposed at intervals. The second antenna module includes a number of second antennas disposed at intervals within a space surrounded by the first antennas. The first and second antennas are of different polarization directions. In one embodiment, the first antennas are horizontally polarized antennas having omnidirectional field patterns. The second antennas are inverted F antennas. By arranging the first and second antennas along an outer ring and an inner ring respectively, the distance between the first and second antenna modules are maximized. Furthermore, by having the first and second antennas with orthogonal polarization directions, the mutual interference between the radiation energy of the first and second antenna modules is effectively reduced.

A semiconductor device includes a semiconductor chip including a communication circuit, a first antenna element formed in a first rewiring layer covering a first surface of the semiconductor chip and connected to the communication circuit, and a second antenna element formed in a second rewiring layer covering a second surface on the side opposite to the first surface of the semiconductor chip and connected to the communication circuit.

A semiconductor device includes a semiconductor chip including a communication circuit, a first antenna element formed in a first rewiring layer covering a first surface of the semiconductor chip and connected to the communication circuit, and a second antenna element formed in a second rewiring layer covering a second surface on the side opposite to the first surface of the semiconductor chip and connected to the communication circuit.

An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

An antenna device includes: antennas; magnetic oscillation element units converting electrical energy to high-frequency power, and a modulator outputting electrical energy input from outside to at least two magnetic oscillation element units, with a time difference to differentiate phases of high-frequency power converted from electrical energy by at least two magnetic oscillation element units. The magnetic oscillation element units respectively include a pair of electrodes, and further include, between the pair of electrodes, a PIN layer, a free layer, and an intermediate layer. A resistance value of an element configured by the PIN, free and intermediate layers changes according to the angle between the magnetization direction of the PIN layer and the magnetization direction of the free layer. The antennas transmit electromagnetic waves to open space outside the magnetic oscillation element units with the supply of high-frequency power.

A system and method for a wireless link to a remote receiver includes a communication device for generating RF and a planar antenna apparatus for transmitting the RF. The planar antenna apparatus includes selectable antenna elements, each of which has gain and a directional radiation pattern. The directional radiation pattern is substantially in the plane of the antenna apparatus. Switching different antenna elements results in a configurable radiation pattern. Alternatively, selecting all or substantially all elements results in an omnidirectional radiation pattern. One or more directors and/or one or more reflectors may be included to constrict the directional radiation pattern. The antenna apparatus may be conformally mounted to a housing containing the communication device and the antenna apparatus.

If a portable device receives a request signal from a control device that requires a response from the portable device, a first response signal is transmitted from the portable device during a common period defined in all portable devices. Thus, in a case where there is no portable device which enables wireless communication with the control device, a value of received signal strength indication of a wireless signal which is received from the portable device by the control device is very small and becomes smaller than the threshold value during a period in the common period. In this case, the control device suspends reception processing of causing a signal to be transmitted from the plurality of portable devices subsequently to the first response signal.

An array antenna with each antenna element in the array being physically tilted away from a base plane of the array. End antenna elements are tilted at a higher angle than regular antenna elements. The radiation pattern, the end antenna elements can provide coverage directly above the antenna array (i.e. at 90 degrees to the horizontal) for different electrical tilts.

An array antenna with each antenna element in the array being physically tilted away from a base plane of the array. End antenna elements are tilted at a higher angle than regular antenna elements. The radiation pattern, the end antenna elements can provide coverage directly above the antenna array (i.e. at 90 degrees to the horizontal) for different electrical tilts.