A connection component can be firmly secured to an adherend member, in a state where a conductive member is compressed, to prevent a babble from remaining in a securing member. The connection component includes a metal terminal, the conductive member provided on one surface of the metal terminal and deformable by compression, the securing member bonded to one surface of the metal terminal, and an exhaust path provided in at least one of the metal terminal and the securing member. The exhaust path is connected to or provided in at least one of a first securing surface of the securing member that is bonded to the metal terminal, and a second securing surface that is opposite to the first securing surface. The exhaust path exhausts a babble generated in at least one of the first securing surface and the second securing surface.

An electrical connector includes a body having an accommodating hole. The body has a protruding block and a platform protruding into the accommodating hole. The platform is located below the protruding block. A conductive terminal is accommodated in the accommodating hole. The conductive terminal has a base, which bends to form an accommodating space to accommodate the protruding block. The base has a through slot, and first and second branches located at two sides of the through slot. A lower section of the first branch is limited between the first protruding block and the platform. A method for manufacturing the electrical connector includes inserting the conductive terminal with the accommodating space opening upward into the accommodating hole by the strip, and rotating the conductive terminal with the protruding block as an axis, until the lower section of the first branch is located between the platform and the first protruding block.

The purpose of the present disclosure is to provide a conductor part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the conductor part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package.

An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

The present invention relates to a signal transmission connector connected to an electronic device, for transmitting an electrical signal, and includes a signal shielding unit in which multiple conductive particles are dispersed within an elastic insulating material in order to shield an external noise signal, a plurality of signal transmission units spaced apart within the signal shielding unit in a form in which the multiple conductive particles are arranged in a thickness direction within the elastic insulating material in such a way as to be connected to terminals of an electronic device, and a plurality of insulation units each disposed to surround the signal transmission unit between the signal transmission unit and the signal shielding unit in order to insulate the plurality of signal transmission units and the signal shielding unit.

A method including the steps of securing a plurality of contact subassemblies to a mold surface at longitudinally spaced locations within a mold with resilient material located between the contact subassemblies and the mold surface, the contact subassemblies including, prior to being placed into the mold, an electrically conductive contact having a flat portion defining lateral ends and side portions associated with the lateral ends of the flat portion and a lead wire secured to the electrically conductive contact, introducing resilient material into the mold to form an electrode array blank including a flexible body defining an exterior surface and the electrically conductive contacts below the exterior, and forming a plurality of windows in the electrode array blank that extend through the exterior surface of the flexible body to the electrically conductive contacts.

An electrical connector includes a body having an accommodating hole. The body has a protruding block and a platform protruding into the accommodating hole. The platform is located below the protruding block. A conductive terminal is accommodated in the accommodating hole. The conductive terminal has a base, which bends to form an accommodating space to accommodate the protruding block. The base has a through slot, and first and second branches located at two sides of the through slot. A lower section of the first branch is limited between the first protruding block and the platform. A method for manufacturing the electrical connector includes inserting the conductive terminal with the accommodating space opening upward into the accommodating hole by the strip, and rotating the conductive terminal with the protruding block as an axis, until the lower section of the first branch is located between the platform and the first protruding block.

A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

In a connection structure, a first electronic component having a first terminal pattern and a second electronic component having a second terminal pattern different in size and pitch from the first terminal pattern are anisotropically conductively connected by an anisotropic conductive film to a third electronic component having a terminal pattern corresponding to each of the first terminal pattern and the second terminal pattern. The anisotropic conductive film has at least one of a region in which conductive particles are regularly arranged, and a plurality of regions in which at least one of a number density, a particle diameter, and a hardness of the conductive particles in one region is different from that in the other region.

A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.