Methods, systems, and apparatuses are described for transferring power. A power transfer device may be configured to securely fit in a fuse block, fuse holder, and/or the like. The power transfer device may transfer power from a source to a load connected to the fuse block, fuse holder, and/or the like, while also isolating the power to prevent the power from backfeeding to the source. The power transfer device may be used to perform testing, measurements, and/or analysis (e.g., voltage measurements, power measurements, frequency analysis, system impedance testing, etc.).

Methods, systems, and apparatuses are described for transferring power. A power transfer device may be configured to securely fit in a fuse block, fuse holder, and/or the like. The power transfer device may transfer power from a source to a load connected to the fuse block, fuse holder, and/or the like, while also isolating the power to prevent the power from backfeeding to the source. The power transfer device may be used to perform testing, measurements, and/or analysis (e.g., voltage measurements, power measurements, frequency analysis, system impedance testing, etc.).

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

A load center assembly is provided. The load center assembly comprises a frame, an electrical panel assembly, and a plurality of electrical wire harnesses. The frame includes a first side and a second side. The first side and the second side are substantially parallel and connected by a plurality of cross members. The electrical panel assembly is connected to the first side and the second side. The electrical panel assembly includes a plurality of breakers. The plurality of electrical wires harnesses is connected to the frame. Each of the plurality of electrical wire harnesses includes a plurality of wires. A first end of each wire of the plurality of wires is routed into the electrical panel assembly and is terminated in a corresponding breaker. The load center assembly is configured to be disposed in a wall frame.

A load center assembly is provided. The load center assembly comprises a frame, an electrical panel assembly, and a plurality of electrical wire harnesses. The frame includes a first side and a second side. The first side and the second side are substantially parallel and connected by a plurality of cross members. The electrical panel assembly is connected to the first side and the second side. The electrical panel assembly includes a plurality of breakers. The plurality of electrical wires harnesses is connected to the frame. Each of the plurality of electrical wire harnesses includes a plurality of wires. A first end of each wire of the plurality of wires is routed into the electrical panel assembly and is terminated in a corresponding breaker. The load center assembly is configured to be disposed in a wall frame.

Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

An electrical connection point configured to electrically connect an electric load in a dwelling to a power grid. The connection point includes: a wall block, including first connection elements, the wall block configured to be mounted securely in a wall of the dwelling such that the first connection elements are electrically connected to corresponding portions of the grid; and a functional block configured to provide a specific electric function and including second connecting elements, wherein the functional block is configured to be removably mounted in the wall block, and thus interchangeable, the attachment providing the electrical connection of the second connection elements to the corresponding portions of the grid via the first connection elements, to allow the electric function to be brought into service.

An electrical connection point configured to electrically connect an electric load in a dwelling to a power grid. The connection point includes: a wall block, including first connection elements, the wall block configured to be mounted securely in a wall of the dwelling such that the first connection elements are electrically connected to corresponding portions of the grid; and a functional block configured to provide a specific electric function and including second connecting elements, wherein the functional block is configured to be removably mounted in the wall block, and thus interchangeable, the attachment providing the electrical connection of the second connection elements to the corresponding portions of the grid via the first connection elements, to allow the electric function to be brought into service.