A method and system are provided to control circuit breaker operations. In the method and system, near-field RF signal is monitored at or around electrical contacts of the circuit breaker using at least one near-field radio frequency (RF) sensor, and far-field RF signal away from the contacts of the circuit breaker are monitored using at least one far-field RF sensor. A rate of change of current over time is also monitored on the circuit using at least one sensor. An arc fault on the circuit is detected based on the monitored near-field RF signal, the monitored far-field RF signal, and the monitored rate of change of current. A tripping operation is implemented on the circuit breaker to disconnect the power supply from the circuit, in response to the detection of the arc fault.

The power source apparatus enables each battery pack to be charged with power supplied from an external charging power supply, and allows power stored in each battery pack to be output externally. Each battery pack is provided with battery pack fault output terminals to send battery pack error signals to other battery packs or to the protection unit when a malfunction occurs. The protection unit is provided with protection unit input-output terminals to connect with battery pack fault output terminals, and a protection circuit capable of cutting-off battery pack current. When a battery pack malfunction occurs, a battery pack error signal is output from the battery pack fault output terminals to the protection unit input-output terminals. When the protection unit detects a battery pack error signal, the protection circuit cuts-off current.

An overvoltage protection device including an output stage, a first switch and a first load providing circuit is provided. The output stage has a first input terminal to receive a first signal, and generates an output signal at an output terminal of the output stage according to the first signal. A first terminal of the first switch is coupled to the first input terminal of the output stage, and a control terminal of the first switch receives a second signal. The first signal is the delayed second signal. The first load providing circuit is coupled to a second terminal of the first switch. The first load providing circuit provides an impedance to the first input terminal when the first switch is turned on.

An overvoltage protection device including an output stage, a first switch and a first load providing circuit is provided. The output stage has a first input terminal to receive a first signal, and generates an output signal at an output terminal of the output stage according to the first signal. A first terminal of the first switch is coupled to the first input terminal of the output stage, and a control terminal of the first switch receives a second signal. The first signal is the delayed second signal. The first load providing circuit is coupled to a second terminal of the first switch. The first load providing circuit provides an impedance to the first input terminal when the first switch is turned on.

A semiconductor device according to related art has a problem that a clamp voltage that clamps an output voltage cannot adaptively vary in accordance with a power supply voltage, and it is thus not possible to reduce heating of a semiconductor chip to a sufficiently low level. According to one embodiment, a semiconductor device includes a drive circuit (10) that controls on and off of an output transistor (13) and an overvoltage protection circuit (12) that controls a conductive state of the output transistor (13) when an output voltage Vout reaches a clamp voltage, and the overvoltage protection circuit (12) has a circuit structure that sets the clamp voltage to vary in proportion to a power supply voltage VDD.

A semiconductor device according to related art has a problem that a clamp voltage that clamps an output voltage cannot adaptively vary in accordance with a power supply voltage, and it is thus not possible to reduce heating of a semiconductor chip to a sufficiently low level. According to one embodiment, a semiconductor device includes a drive circuit (10) that controls on and off of an output transistor (13) and an overvoltage protection circuit (12) that controls a conductive state of the output transistor (13) when an output voltage Vout reaches a clamp voltage, and the overvoltage protection circuit (12) has a circuit structure that sets the clamp voltage to vary in proportion to a power supply voltage VDD.

A disconnector device including an isolator connected between a first terminal and to a second terminal, and a sleeve positioned around the isolator and moveable between an un-extended position prior to the isolator operating and an extended position after the isolator operates, the sleeve being configured to trap debris produced by operation of the isolator.

A disconnector device including an isolator connected between a first terminal and to a second terminal, and a sleeve positioned around the isolator and moveable between an un-extended position prior to the isolator operating and an extended position after the isolator operates, the sleeve being configured to trap debris produced by operation of the isolator.

A bus system comprises a feed module, a load module and a data cable connecting the feed module to the load module. A fuse is provided in an energy path and/or respectively in an energy/data transmission path between a feed module and a load module.

A protection device comprises a first substrate, a second substrate, a fusible element and a heating element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The fusible element is disposed on the first surface of the first substrate, and the heating element is disposed on the second surface of the second substrate and is disposed above the fusible element. When over-voltage or over-temperature occurs, the heating element heats up to blow the fusible element and thereby providing over-voltage and over-temperature protection.