An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.

Relax oscillation circuits have at least one comparison circuit that is structured with a flipped gate transistor and a normal MOS transistor wherein the two transistors having different threshold voltages. The relaxation oscillators are configured for charging and discharging capacitances between the threshold voltages of the flipped gate transistor and the normal MOS transistor by toggling the state of a latching circuit to control the charging and discharging of the capacitances.

Relax oscillation circuits have at least one comparison circuit that is structured with a flipped gate transistor and a normal MOS transistor wherein the two transistors having different threshold voltages. The relaxation oscillators are configured for charging and discharging capacitances between the threshold voltages of the flipped gate transistor and the normal MOS transistor by toggling the state of a latching circuit to control the charging and discharging of the capacitances.

A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.

A CMOS gain element is disclosed herein. Also disclosed herein are splitters, comprising the CMOS gain element, and local oscillator distribution circuitry comprising the splitters and the CMOS gain elements. Semiconductor devices comprising the local oscillator distribution circuitry may have smaller footprints and reduced power consumption relative to prior art devices.

A CMOS gain element is disclosed herein. Also disclosed herein are splitters, comprising the CMOS gain element, and local oscillator distribution circuitry comprising the splitters and the CMOS gain elements. Semiconductor devices comprising the local oscillator distribution circuitry may have smaller footprints and reduced power consumption relative to prior art devices.

Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes an inductor included in an integrated circuit device, and a first oscillator and a second oscillator included in the integrated circuit device. The first oscillator includes a first terminal coupled to a conductive path of the inductor to provide a first signal. The second oscillator includes a second terminal coupled to the conductive path to provide a second signal. The first and second signals have different frequencies.

Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes an inductor included in an integrated circuit device, and a first oscillator and a second oscillator included in the integrated circuit device. The first oscillator includes a first terminal coupled to a conductive path of the inductor to provide a first signal. The second oscillator includes a second terminal coupled to the conductive path to provide a second signal. The first and second signals have different frequencies.

An oscillator includes an external terminal, a resonator, and an oscillation circuit that oscillates the resonator. The oscillation circuit includes an amplification circuit and a current source that supplies a current to the amplification circuit, and the current is variably set according to a control signal input from the external terminal.