A sine wave generator includes a resonator circuit, a control circuit and a pulse generator. The resonator circuit is configured to receive energy pulses and to generate a resonator sinusoidal signal responsively to the energy pulses. The control circuit is configured to estimate a signal measure of the resonator sinusoidal signal, or of a signal derived from the resonator sinusoidal signal. The pulse generator is configured to generate the energy pulses responsive to the signal measure estimated by the control circuit, and to drive the resonator circuit with the energy pulses.

In one embodiment, a tuning network includes: a controllable capacitance; a first switch coupled between the controllable capacitance and a reference voltage node; a second switch coupled between the controllable capacitance and a third switch; the third switch coupled between the second switch and a second voltage node; a fourth switch coupled between the second voltage node and a first inductor; the first inductor having a first terminal coupled to the fourth switch and a second terminal coupled to at least the second switch; and a second inductor having a first terminal coupled to the second terminal of the first inductor and a second terminal coupled to the controllable capacitance.

A circuit includes an oscillator having a driver and a resonator. The driver receives a supply voltage at a supply input and provides a drive output to drive the resonator to generate an oscillator output signal. A power converter receives an input voltage and generates the supply voltage to the supply input of the driver. A temperature tracking device in the power converter controls the voltage level of the supply voltage to the supply input of the driver based on temperature such that the supply voltage varies inversely to the temperature of the circuit.

A circuit includes an oscillator having a driver and a resonator. The driver receives a supply voltage at a supply input and provides a drive output to drive the resonator to generate an oscillator output signal. A power converter receives an input voltage and generates the supply voltage to the supply input of the driver. A temperature tracking device in the power converter controls the voltage level of the supply voltage to the supply input of the driver based on temperature such that the supply voltage varies inversely to the temperature of the circuit.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

Semiconductor devices and methods relating to the semiconductor devices are provided. A semiconductor device includes a resonant clock circuit. The semiconductor device further includes an inductor. The semiconductor device also includes a magnetic layer formed of a magnetic material disposed in between a portion of the resonant clock circuit and the inductor. Clock signals of the resonant clock circuit are utilized by the magnetic layer.

Semiconductor devices and methods relating to the semiconductor devices are provided. A semiconductor device includes a resonant clock circuit. The semiconductor device further includes an inductor. The semiconductor device also includes a magnetic layer formed of a magnetic material disposed in between a portion of the resonant clock circuit and the inductor. Clock signals of the resonant clock circuit are utilized by the magnetic layer.

A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

A resistor-capacitor oscillation circuit includes a first group of inverters, a second group of inverters, a latch, a delay circuit, and a third group of inverters. The first group of the inverters is connected to the delay circuit and is configured to generate a first signal A and a second signal B. An input end of the second group of the inverters is connected to an enable signal EN. An output end of the second group of the inverters is connected to the latch. An output end of the delay circuit is connected to the latch. The latch is connected to the third group of the inverters and includes a first output end and a second output end. After a first clock signal FB is driven by the third group of the inverters, an output signal CLK is output by an output end of the third group.