An apparatus includes a microelectromechanical system (MEMS) die having a first surface and an opposing second surface. The MEMS die includes a surface-mounted resonator on the first surface and includes a first inductor. The apparatus also includes first and second dies. The first die has a third surface and an opposing fourth surface. The first die is coupled to the MEMS die such that the third surface of the first die faces the first surface of the MEMS die. The first and second surfaces are spaced apart. The first die includes an oscillator circuit and a second inductor. The oscillator circuit is coupled to the second inductor. The second inductor is inductively coupled to the first inductor. The second die is electrically coupled to the first die.

Systems and methods are provided for compensating for mechanical acceleration at a reference oscillator. A reference oscillator provides an oscillator output signal and an accelerometer on a same platform as the reference oscillator, such that mechanical acceleration at the reference oscillator is detected at the accelerometer to produce a measured acceleration. A filter assembly, having an associated set of filter weights, receives the measured acceleration from the accelerometer and provides a tuning control signal responsive to the measured acceleration to a frequency reference associated with the system. An adaptive weighting component receives the oscillator output signal of the reference oscillator and an external signal that is provided from a source external to the platform and adjusts the set of filter weights for the filter assembly based on a comparison of the external signal and the oscillator output signal.

Systems and methods are provided for compensating for mechanical acceleration at a reference oscillator. A reference oscillator provides an oscillator output signal and an accelerometer on a same platform as the reference oscillator, such that mechanical acceleration at the reference oscillator is detected at the accelerometer to produce a measured acceleration. A filter assembly, having an associated set of filter weights, receives the measured acceleration from the accelerometer and provides a tuning control signal responsive to the measured acceleration to a frequency reference associated with the system. An adaptive weighting component receives the oscillator output signal of the reference oscillator and an external signal that is provided from a source external to the platform and adjusts the set of filter weights for the filter assembly based on a comparison of the external signal and the oscillator output signal.

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operatein effect, heating the MEMS component and optionally related circuitry to a steady-state oven temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operatein effect, heating the MEMS component and optionally related circuitry to a steady-state oven temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

A circuit device includes a drive circuit driving a resonator, an oscillation circuit having the resonator and a variable capacitance circuit coupled to an oscillation loop including the drive circuit, and a D/A converter circuit that performs D/A conversion on frequency control data and outputs a first voltage signal and a second voltage signal which are differential signals. The variable capacitance circuit includes a first variable capacitance capacitor, to one end of which the first voltage signal is input and, to the other end of which a first bias voltage is input and a second variable capacitance capacitor, to one end of which the second voltage signal is input and, to the other end of which a second bias voltage is input.

A circuit device includes a drive circuit driving a resonator, an oscillation circuit having the resonator and a variable capacitance circuit coupled to an oscillation loop including the drive circuit, and a D/A converter circuit that performs D/A conversion on frequency control data and outputs a first voltage signal and a second voltage signal which are differential signals. The variable capacitance circuit includes a first variable capacitance capacitor, to one end of which the first voltage signal is input and, to the other end of which a first bias voltage is input and a second variable capacitance capacitor, to one end of which the second voltage signal is input and, to the other end of which a second bias voltage is input.

An oscillation circuit that causes a vibrator to oscillate includes a bipolar transistor for oscillation, a P-type transistor having a gate to which a collector voltage of the bipolar transistor is input and a source to which a base of the bipolar transistor is connected, a first current source that supplies a current to the bipolar transistor, and a second current source that supplies a current to the P-type transistor.

In some aspects, the disclosure is directed to methods and systems for utilizing a thin-film bulk acoustic resonator (FBAR) as a frequency reference for a phase-locked loop (PLL) circuit controlling frequency of a voltage controlled oscillator (VCO). In some implementations, the FBAR-based oscillator may be used as a reference to an analog or digital PLL circuit (either directly, or divided to a lower frequency). In other implementations, the FBAR-based oscillator may be used as a reference to a mixing-based PLL rather than a dividing-based PLL. Through these implementations, the noise contribution of many of the PLL circuit components or elements may be reduced (e.g. noise from a delta-sigma modulator (DSM), multiple modulus divider (MMD), phase frequency detector (PFD)/charge pump (CP), etc.).

In some aspects, the disclosure is directed to methods and systems for utilizing a thin-film bulk acoustic resonator (FBAR) as a frequency reference for a phase-locked loop (PLL) circuit controlling frequency of a voltage controlled oscillator (VCO). In some implementations, the FBAR-based oscillator may be used as a reference to an analog or digital PLL circuit (either directly, or divided to a lower frequency). In other implementations, the FBAR-based oscillator may be used as a reference to a mixing-based PLL rather than a dividing-based PLL. Through these implementations, the noise contribution of many of the PLL circuit components or elements may be reduced (e.g. noise from a delta-sigma modulator (DSM), multiple modulus divider (MMD), phase frequency detector (PFD)/charge pump (CP), etc.).