The present disclosure provides an oscillator circuit, a chip and an electronic device. The oscillator circuit includes two charge and discharge circuits, a reference voltage switching module, two comparators and a logic control module. When an output of either of the comparators, the logic control module controls one charge and discharge circuit connected to the comparator to discharge, controls the other charge and discharge circuit to charge, and controls the reference voltage switching module to switch a reference voltage of the comparator to a second voltage. When the output of the comparator transitions back, the logic control module controls the one charge and discharge circuit to charge. When the output of the comparator transitions again, the logic control module controls the reference voltage switching module to switch the reference voltage of the comparator to a first voltage, and controls one charge and discharge circuit to stop charging.

In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.

In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.

A method and apparatus for increasing the Signal-to-Noise Ratio (SNR) of phononic comb teeth generated by a non-linear resonator. The method comprises generating a drive signal; applying the drive signal to the non-linear resonator with sufficient gain to generate the phononic comb teeth; and filtering the drive signal before applying it to the non-linear resonator to thereby increase the Signal-to-Noise Ratio (SNR) of phononic comb teeth generated by the non-linear resonator. The apparatus may comprise a circuit including a filter disposed between an oscillator generating the drive signal and the non-linear resonator, the filter preferably having a 3 db passband width which is less than a spacing of the phononic comb teeth generated by the non-linear resonator.

A self-oscillation circuit includes a vibration unit having a vibrator, a positive feedback path which positively feeds back a signal based on vibration of the vibrator to the vibration unit, a negative feedback circuit which generates a pulse-width-modulated signal having a frequency lower than a vibration frequency of the vibrator, based on a comparison result between a value corresponding to an amplitude of the vibrator and a reference value, and a switch circuit which switches connection and disconnection of the positive feedback path to the vibration unit by the pulse-width-modulated signal.

A resonator is provided that includes a vibrating portion including a three or more vibrating arms each having a fixed end and a free end, with at least two of the vibrating arms configured to bend out of plane in different phases, and a base having a front end connected to the fixed end of each vibrating arm and a rear end opposite from the front end. Moreover, a frame is disposed at least partially around the vibrating portion, a holding arm is provided between the vibrating portion and the holding portion and includes a first end connected to the base and a second end connected to the frame, and a plurality of holes disposed in the vibrating portion. Moreover, the plurality of holes are each formed in a region between any one pair of adjacent two of the plurality of vibrating arms in the base portion.

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

An oscillator system includes a first oscillator structure configured to oscillate about a first rotation axis at a first oscillation frequency; a second oscillator structure configured to oscillate about a second rotation axis at a second oscillation frequency; a driver circuit configured to generate a first driving signal to drive an oscillation of the first oscillator structure with a first oscillation phase and the first oscillation frequency and generate a second driving signal to drive an oscillation of the second oscillator structure with a second oscillation phase and the second oscillation frequency. The first oscillation frequency and the second oscillation frequency have a variable frequency ratio with respect to each other that varies over time. The driver circuit is configured to modulate at least one of the first oscillation phase or the second oscillation phase to modulate the variable frequency ratio.

An oscillator system includes a first oscillator structure configured to oscillate about a first rotation axis at a first oscillation frequency; a second oscillator structure configured to oscillate about a second rotation axis at a second oscillation frequency; a driver circuit configured to generate a first driving signal to drive an oscillation of the first oscillator structure with a first oscillation phase and the first oscillation frequency and generate a second driving signal to drive an oscillation of the second oscillator structure with a second oscillation phase and the second oscillation frequency. The first oscillation frequency and the second oscillation frequency have a variable frequency ratio with respect to each other that varies over time. The driver circuit is configured to modulate at least one of the first oscillation phase or the second oscillation phase to modulate the variable frequency ratio.