H03B5/30

ADAPTIVE MICROPHONICS NOISE CANCELLATION
20220216829 · 2022-07-07 ·

Systems and methods are provided for compensating for mechanical acceleration at a reference oscillator. A reference oscillator provides an oscillator output signal and an accelerometer on a same platform as the reference oscillator, such that mechanical acceleration at the reference oscillator is detected at the accelerometer to produce a measured acceleration. A filter assembly, having an associated set of filter weights, receives the measured acceleration from the accelerometer and provides a tuning control signal responsive to the measured acceleration to a frequency reference associated with the system. An adaptive weighting component receives the oscillator output signal of the reference oscillator and an external signal that is provided from a source external to the platform and adjusts the set of filter weights for the filter assembly based on a comparison of the external signal and the oscillator output signal.

ADAPTIVE MICROPHONICS NOISE CANCELLATION
20220216829 · 2022-07-07 ·

Systems and methods are provided for compensating for mechanical acceleration at a reference oscillator. A reference oscillator provides an oscillator output signal and an accelerometer on a same platform as the reference oscillator, such that mechanical acceleration at the reference oscillator is detected at the accelerometer to produce a measured acceleration. A filter assembly, having an associated set of filter weights, receives the measured acceleration from the accelerometer and provides a tuning control signal responsive to the measured acceleration to a frequency reference associated with the system. An adaptive weighting component receives the oscillator output signal of the reference oscillator and an external signal that is provided from a source external to the platform and adjusts the set of filter weights for the filter assembly based on a comparison of the external signal and the oscillator output signal.

Method for manufacturing a micromechanical layer structure
11405010 · 2022-08-02 · ·

A method for manufacturing a micromechanical layer structure, including: providing a first protective layer patterned to have at least one opening which is filled with sacrificial layer material; depositing a functional-layer layer structure; producing a first opening in the functional-layer layer structure to at least one opening of the first protective layer, so that in at least one of the layers of the functional-layer layer structure; depositing a second protective layer so that the first opening is filled with material of the second protective layer; patterning the second protective layer and the filled first opening to have a second opening to the first protective layer, the second opening having the same or a lesser width than the first opening; removing sacrificial layer material at least in the opening of the first protective layer; and removing protective layer material at least in the second opening.

Remote temperature measurement system for gas turbine engine

A remote temperature measurement system for a gas turbine engine includes an optical emitter/receiver in communication with the control system and a probe system embedded within a component of the gas turbine engine, the probe system within a line-of-sight of the optical emitter/receiver, the control system operable to determine a local temperature of the component in response to optical communication with the probe system.

Remote temperature measurement system for gas turbine engine

A remote temperature measurement system for a gas turbine engine includes an optical emitter/receiver in communication with the control system and a probe system embedded within a component of the gas turbine engine, the probe system within a line-of-sight of the optical emitter/receiver, the control system operable to determine a local temperature of the component in response to optical communication with the probe system.

Semiconductor package structure

A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Semiconductor package structure

A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Semiconductor device and oscillator
11302632 · 2022-04-12 · ·

A semiconductor device includes a first high resistance pattern and a second high resistance pattern that are disposed along an X axis and are separated from each other, a coupling pattern that couples the first high resistance pattern and the second high resistance pattern, and a signal wiring disposed at a layer above the first high resistance pattern, the second high resistance pattern, and the coupling pattern. The coupling pattern includes a first portion that overlaps an end portion of the first high resistance pattern in a plan view at the layer above the first high resistance pattern, the coupling pattern includes a second portion that overlaps an end portion of the second high resistance pattern in a plan view at a layer above the second high resistance pattern, and the signal wiring is disposed along a Y axis that intersects the X axis in a plan view between an end of the coupling pattern at the first portion side and an end of the coupling pattern at the second portion side.

Voltage controlled oscillation device and wireless transceiver
11303246 · 2022-04-12 · ·

The present disclosure provides a voltage controlled oscillation device and a wireless transceiver. The voltage controlled oscillation device includes a resonator, an oscillation core circuit, a switch circuit and a control device. The oscillation core circuit is configured to provide signals of different phases to the resonator. The resonator is configured to generate a plurality of different resonance frequencies. The control device is configured to control the connection/disconnection among ends of the resonator through controlling the switch circuit to be on/off, so that the resonator retains two resonance frequencies from the plurality of different resonance frequencies. The control device is further configured to change the retained two resonance frequencies by controlling the switch circuit to be turn on/off. The resonator is further configured to process two resonance frequencies under action of oscillation core circuit, and output a fundamental signal of one resonance frequency.

Voltage controlled oscillation device and wireless transceiver
11303246 · 2022-04-12 · ·

The present disclosure provides a voltage controlled oscillation device and a wireless transceiver. The voltage controlled oscillation device includes a resonator, an oscillation core circuit, a switch circuit and a control device. The oscillation core circuit is configured to provide signals of different phases to the resonator. The resonator is configured to generate a plurality of different resonance frequencies. The control device is configured to control the connection/disconnection among ends of the resonator through controlling the switch circuit to be on/off, so that the resonator retains two resonance frequencies from the plurality of different resonance frequencies. The control device is further configured to change the retained two resonance frequencies by controlling the switch circuit to be turn on/off. The resonator is further configured to process two resonance frequencies under action of oscillation core circuit, and output a fundamental signal of one resonance frequency.