H03C7/02

Embedding data on a power signal

Disclosed are various embodiments for embedding data on a guided surface wave. A guided surface waveguide probe emits power as a guided surface wave received by a guided surface wave receive structure circuit. An aggregate electric load of the receiver circuit is modulated with reference to a data signal. A current at the guided surface waveguide probe is monitored. A data signal is recaptured at the guided surface waveguide probe.

Modulation processing method and apparatus for high-order coding, base station, and terminal

The present document provides a modulation processing method and apparatus for high-order coding, a base station and a terminal, herein the method includes: a base station selecting a Modulation and Coding Scheme (MCS) table according to a transmission type and predefined information, herein the MCS table includes a MCS table supporting a M-order modulation and a MCS table not supporting a M-order modulation, herein M>64; and the base station transmitting downlink control signaling to a terminal, the downlink control signaling including a modulation and coding scheme field I.sub.MCS, herein the I.sub.MCS is based on the MCS table supporting or not supporting a M-order modulation selected by the base station.

Modulation processing method and apparatus for high-order coding, base station, and terminal

The present document provides a modulation processing method and apparatus for high-order coding, a base station and a terminal, herein the method includes: a base station selecting a Modulation and Coding Scheme (MCS) table according to a transmission type and predefined information, herein the MCS table includes a MCS table supporting a M-order modulation and a MCS table not supporting a M-order modulation, herein M>64; and the base station transmitting downlink control signaling to a terminal, the downlink control signaling including a modulation and coding scheme field I.sub.MCS, herein the I.sub.MCS is based on the MCS table supporting or not supporting a M-order modulation selected by the base station.

Frequency modulation assembly and cavity filter

A frequency modulation assembly includes a self-locking screw, a self-locking adjuster and an elastic member. The self-locking screw has a first external screw thread, the self-locking adjuster has a mounting hole in which an internal screw thread is formed, the self-locking screw is inserted into the mounting hole, and the first external screw thread is engaged with the internal screw thread to achieve a connection between the self-locking screw and the self-locking adjuster, one end of the self-locking screw which passes through the mounting hole is inserted into a ceramic resonance rod in the cavity filter, and the elastic member is connected with the self-locking screw and configured between the self-locking adjuster and the ceramic resonance rod. The frequency modulation assembly can decrease accumulated assembly tolerances, reduce manufacturing cost and improve assembly efficiency, further the elastic member is beneficial to adjust the accuracy of the frequency modulation effect.

Frequency modulation assembly and cavity filter

A frequency modulation assembly includes a self-locking screw, a self-locking adjuster and an elastic member. The self-locking screw has a first external screw thread, the self-locking adjuster has a mounting hole in which an internal screw thread is formed, the self-locking screw is inserted into the mounting hole, and the first external screw thread is engaged with the internal screw thread to achieve a connection between the self-locking screw and the self-locking adjuster, one end of the self-locking screw which passes through the mounting hole is inserted into a ceramic resonance rod in the cavity filter, and the elastic member is connected with the self-locking screw and configured between the self-locking adjuster and the ceramic resonance rod. The frequency modulation assembly can decrease accumulated assembly tolerances, reduce manufacturing cost and improve assembly efficiency, further the elastic member is beneficial to adjust the accuracy of the frequency modulation effect.

SIGNAL TRANSMISSION LINE INCLUDING ELECTRICALLY THIN RESISTIVE LAYER AND ASSOCIATED METHODS
20180108966 · 2018-04-19 ·

A signal transmission line includes: a first electrical conductor; a second electrical conductor; a dielectric region between the first electrical conductor and the second electrical conductor; and an electrically thin resistive layer disposed within the dielectric region and disposed between the first electrical conductor and the second electrical conductor. A gap exists in the electrically thin resistive layer.

SIGNAL TRANSMISSION LINE INCLUDING ELECTRICALLY THIN RESISTIVE LAYER AND ASSOCIATED METHODS
20180108966 · 2018-04-19 ·

A signal transmission line includes: a first electrical conductor; a second electrical conductor; a dielectric region between the first electrical conductor and the second electrical conductor; and an electrically thin resistive layer disposed within the dielectric region and disposed between the first electrical conductor and the second electrical conductor. A gap exists in the electrically thin resistive layer.

Magnetic absorbers for passive intermodulation mitigation

A wireless communication system including an electrically conductive passive medium capable of simultaneously propagating therealong electromagnetic first and second currents at different respective frequencies F1 and F2, the electrically conductive passive medium including an electrically conductive first passive linear medium portion adjacent an electrically conductive first passive nonlinear medium portion, the first passive nonlinear medium portion capable of generating an intermodulation current based on a nonlinear interaction between the first and second currents, the intermodulation current having a frequency Fi equal to nF1+mF2 and propagating along the first passive nonlinear medium portion, m and n being positive or negative integers; and a first magnetic film disposed proximate an electrically conductive external surface of the first linear medium portion, such that when the first and second currents propagate along the first passive linear medium portion toward the first passive nonlinear medium portion, the magnetic film reduces or prevents the generation of the intermodulation current in the first passive nonlinear medium portion by attenuating at least portions of the first and second currents.

High frequency modulation circuits based on photoconductive wide bandgap switches

Methods, systems, and devices for high voltage and/or high frequency modulation. In one aspect, an optoelectronic modulation system includes an array of two or more photoconductive switch units each including a wide bandgap photoconductive material coupled between a first electrode and a second electrode, a light source optically coupled to the WBGP material of each photoconductive switch unit via a light path, in which the light path splits into multiple light paths to optically interface with each WBGP material, such that a time delay of emitted light exists along each subsequent split light path, and in which the WBGP material conducts an electrical signal when a light signal is transmitted to the WBGP material, and an output to transmit the electrical signal conducted by each photoconductive switch unit. The time delay of the photons emitted through the light path is substantially equivalent to the time delay of the electrical signal.

METHODS AND APPARATUSES FOR RYDBERG EXCITATION, SPECTROSCOPY, AND QUANTUM TECHNOLOGY, AND IMPROVEMENTS IN RECEIVING AND TRANSMITTING ELECTROMAGNETIC WAVES AND SIGNALS AND ATOM RADIO COMMUNICATION APPARATUSES THEREFOR
20240413829 · 2024-12-12 ·

The present disclosure relates to atomic quantum and photonic apparatuses and methods, for example, atomic radio apparatuses and methods. The disclosure describes various aspects of atomic radio. More specifically, the disclosure describes an atomic radio apparatus and associated hardware. Methods for performing radio communications, sensing, and imaging, are described. The disclosure further describes laser, optical, photonics, atom-photonics, and hybrid micro-integrated subsystems for Rydberg excitation, spectroscopy, and quantum technology.