Voltage ripple suppression in a transmission circuit is disclosed. The transmission circuit includes a power amplifier circuit coupled to an envelope tracking integrated circuit (ETIC) via a conductive path. Notably, the ETIC and the conductive path can present a large source impedance to the power amplifier circuit, which can cause a ripple in the modulated voltage received by the power amplifier circuit. In a conventional approach, the large source impedance may be isolated by a large decoupling capacitor at the expense of increased voltage switching time and battery current drain. In contrast, the ETIC disclosed herein can determine and apply a correction term to the modulated voltage generated by the ETIC to thereby suppress the ripple without requiring the large decoupling capacitor. By eliminating the large decoupling capacitor, the transmission circuit can thus achieve fast voltage switching with lower battery current drain.

Amplifiers, amplification circuits, and phase shifters, for example, for flexibly adjusting an output phase to thereby meet a requirement of a constant phase on a link in a communications field, are provided. In one aspect, an amplifier includes first, second, and third MOS transistors. The first MOS transistor includes a gate separately coupled to a signal input end and a bias voltage input end, a source coupled to a power supply, and a drain separately coupled to sources of the second and third MOS transistors. A drain of the third MOS transistor is coupled to a ground, and a drain of the second MOS transistor is coupled to a signal output end. The bias voltage input end is configured to receive a bias voltage to adjust a phase difference between an input signal at the signal input end and an output signal at the signal output end.

A power amplifier module includes a first transistor that amplifies and outputs a signal, a second transistor that supplies a bias current to a base of the first transistor, and a ballast resistor circuit that is disposed between the base and an emitter of the second transistor and that includes first and second resistive elements and a switching element. The first resistive element is arranged in series on a line connecting the base and the emitter. The first and second resistive elements are series-connected or parallel-connected. When the second resistive element is series-connected to the first transistor, the switching element is parallel-connected to the second resistive element. When the second resistive element is parallel-connected to the first transistor, the switching element is series-connected to the second resistive element. The switching element is switched on/off based on a collector current of the second transistor.

A compensation circuit, chip, method and device, a storage medium, and an electronic device are disclosed. The compensation circuit may include an analog module (102) including an input node (1022) and an output node (1024), wherein the input node (1022) is configured to receive an input signal and the output node (1024) is configured to output an output signal; and a linearity compensation module (104) including a plurality of transconductance units (1042), where the plurality of transconductance units (1042) are configured to acquire a first configuration signal and configure a combination of the plurality of transconductance units (1042) based on the first configuration signal to provide a compensation signal to the output node (1024), and the first configuration signal is configured to indicate a signal at any position in the analog module (102).

Provided is a method of processing an input signal of an amplifier in an electronic device, the method including obtaining a pre-distorter configured to pre-distort an input signal of the amplifier by using a pretrained neural network model to pre-distort the input signal of the amplifier based on signals input to and output from the amplifier, which are obtained while the amplifier operates in a plurality of different environments, and a plurality of pieces of environmental information corresponding to the plurality of different environments, obtaining an input signal for the amplifier, obtaining information about an environment of the amplifier, pre-distorting the input signal by using the pre-distorter based on the obtained environmental information to prevent an output signal in response to the input signal to be processed by the amplifier from being distorted, and inputting the pre-distorted input signal to the amplifier.

A power amplifier includes a transistor, a temperature sensor and a filter. The transistor is used to receive a bias signal and amplify a radio frequency (RF) signal. The temperature sensor is arranged in proximity to the transistor, and is used to detect a temperature of the transistor to provide a voltage signal at a control node accordingly. The filter is coupled to the temperature sensor and is used to filter the voltage signal to generate a filtered voltage. The bias signal is adjusted according to the filtered voltage.

A radio frequency (RF) amplifier and a bias circuit are provided. The RF amplifier includes an amplifier, a first inductive-capacitive resonance circuit, and a first bias circuit. The amplifier includes an input terminal configured to receive an incoming RF signal through a first RF path. The first inductive-capacitive resonance circuit includes a first terminal coupled to a first reference voltage. A second terminal of the first inductive-capacitive resonance circuit is coupled to the first RF path. In response to the first reference voltage being at a first reference level, the RF amplifier is enabled; in response to the first reference voltage being at a second reference level, the RF amplifier is disabled. The first bias circuit includes a first terminal configured to be coupled to the first reference voltage and a second terminal coupled to the input terminal of the amplifier to provide a first direct current (DC) component.

Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.

Provided is a generator that includes a housing, a high-power circuit including a power amplifier, and a low-power circuit. An air flow guidance plate divides the housing into at least two compartments including a high-power compartment and a low-power compartment. The high-power circuit is disposed within the high-power compartment and the low-power circuit is disposed within the low-power compartment.

Provided in the present invention are a linear compensation method for a radio frequency amplifier and a magnetic resonance imaging system. The linear compensation method for a radio frequency amplifier includes determining a working voltage of the radio frequency amplifier, determining a corresponding linear compensation value based on the working voltage, and performing linear compensation on the radio frequency amplifier based on the linear compensation value.