A compensation circuit, chip, method and device, a storage medium, and an electronic device are disclosed. The compensation circuit may include an analog module (102) including an input node (1022) and an output node (1024), wherein the input node (1022) is configured to receive an input signal and the output node (1024) is configured to output an output signal; and a linearity compensation module (104) including a plurality of transconductance units (1042), where the plurality of transconductance units (1042) are configured to acquire a first configuration signal and configure a combination of the plurality of transconductance units (1042) based on the first configuration signal to provide a compensation signal to the output node (1024), and the first configuration signal is configured to indicate a signal at any position in the analog module (102).

A semiconductor device includes: an operational amplifier; an external terminal configured to be attached to an external capacitor; and a resistor configured to be connected between a node, to which an output terminal and an inverting input terminal of the operational amplifier are connected in common, and the external terminal.

Low-leakage switch circuit techniques to reduce leakage current of an off-state switch, while maintaining a low on-resistance. The low-leakage switch circuit may allow measurement of low current signals in a transimpedance amplifier with improved accuracy without, the need for calibration. The low-leakage switch circuit may include a bootstrapping path connecting two or more terminals or voltage nodes of an off-state switch in the switch circuit. The bootstrapping path is configured to bootstrap major leakage current contributors in the switch circuit, such as the substrate diode leakage, the subthreshold leakage, or combinations thereof.

A circuit includes an operational amplifier and a resistor network coupled to an output of the operational amplifier. The resistor network includes a first set of resistors coupled between the output of the operational amplifier and a first node of the resistor network, wherein the resistors of the first set are electrically connected in series with each other, a second set of resistors coupled between the first node and a second node of the resistor network, wherein the resistors of the second set are electrically connected in series with each other and include a first number of resistors, a third set of resistors coupled between the second node and a third node of the resistor network, wherein the third node is coupled to a first voltage, and wherein the resistors of the third set are electrically connected in parallel with each other and include a second number of resistors, and a resistor coupled between the first node and the second node and arranged in parallel with the second set of resistors.

A driver circuit includes: a current-controlling switching element electrically connected to a light emitting element; a differential amplifier circuit including: an output terminal electrically connected to the current-controlling switching element, a first input terminal configured to receive a reference signal as a reference for radiating light with a desired intensity from the light emitting element, and a second input terminal configured to receive a detection signal corresponding to a detection result of a current flowing in the light emitting element, wherein the differential amplifier circuit is configured to control the current flowing in the light emitting element and the current-controlling switching element based on a voltage of the first input terminal and a voltage of the second input terminal; and an adjustment part configured to adjust an overshoot amount of a rising edge of the current flowing in the light emitting element.

A first transmission line and a second transmission line that are connected in series to each other are disposed at different positions in a thickness direction of a substrate. A third transmission line is disposed between the first transmission line and the second transmission line in the thickness direction of the substrate. The third transmission line includes a first end portion connected to one end portion of the first transmission line, and a second end portion that is AC-grounded. The first transmission line and the second transmission line are electromagnetically coupled to the third transmission line.

A transconductance amplifier (TCA) implemented with high electron mobility transistors (HEMTs) in a push-pull amplifier output stage provides a voltage controlled constant high output current to loads ranging from 10 mΩ to 1Ω with a bandwidth of 25 MHz. A driving stage for the HEMTs is implemented with variable gain amplifiers that amplify the input voltage signal and provide bias for the HEMTs. An automatic gain control may be connected between the TCA output and the variable gain amplifiers to ensure a constant current output for a varying load.

A differential amplifier is provided. The differential amplifier includes a first single-ended amplifying means including at least a first terminal and a second terminal, a second single-ended amplifying means including at least a first terminal and a second terminal, a first transmission line, and a second transmission line. In this context, the first terminal of the first single-ended amplifying means is connected to the second terminal of the second single-ended amplifying means via the first transmission line. In addition to this, the first terminal of the second single-ended amplifying means is connected to the second terminal of the first single-ended amplifying means via the second transmission line.

A packaged semiconductor die may include a package terminal array comprising a plurality of terminals, wherein a spacing between the plurality of terminals of the ball grid array is less than 0.5 mm. First and second high-voltage circuits of the die may output a differential signal to a first and second terminal that may exceed 15 volts, in which the first high-voltage circuit and the second high-voltage circuit are positioned symmetrically around an axis and in which the first terminal and the second terminal are located at an edge of the package terminal array. A low-voltage circuit may be coupled to a third terminal and positioned between the first high-voltage circuit and the second high-voltage circuit, wherein the low-voltage circuit comprises circuitry organized in columns aligned along an axis and having a width defined by a fraction of the terminal spacing pitch.

A radio frequency (RF) equalizer in an envelope tracking (ET) circuit is disclosed. A transmitter chain includes an ET circuit having an RF equalizer therein. The RF equalizer includes a two operational amplifier (op-amp) structure that provides a relatively flat gain and a relatively constant negative group delay across a frequency range of interest (e.g., up to 200 MHz). The simple two op-amp structure provides frequency response equalization and time tuning adjustment and/or creates a window Vcc signal.